LED Emitters - Infrared, UV, Visible

Part Number	Description / PDF	Quantity
LA UV43WP2 DComponents	UV LED DIE, 415NM,640MW,500MA,11	319
LA UY43WP2 DComponents	UV LED DIE, 365NM,500MW,500MA,11	1081
LA UZ427P2 DComponents	UV LED DIE, 275NM,30MW,350MA,106	30
LA UX42WP1 DComponents	UV LED DIE, 395NM,950MW,500MA,10	14781
LA UZ404P1 DComponents	UV LED DIE, 340NM,45MW,350MA,100	0
LA UX43WP2 DComponents	UV LED DIE, 395NM,850MW,500MA,11	1899
LA UX47WP6 DComponents	UV LED DIE, 395NM,1500MW,1000MA,	206622
LA UZ401P1 DComponents	UV LED DIE, 310NM,50MW,350MA,100	0
LA UZ403P1 DComponents	UV LED DIE, 325NM,45MW,350MA,100	0
LA UY42WP1 DComponents	UV LED DIE, 365NM,700MW,500MA,11	3739
LA RM10CIS DComponents	INFRARED LED,785NM,40MW,50MA,10	0
LA TM120CIS DComponents	INFRARED LED,730NM,5MW,20MA,120	0
LA KG120U8F DComponents	UV LED,275NM,250MW,300MA,0.2 - 0	0
LA NI09WP3 DComponents	INFRARED LED DIE,850NM,7MW,20MA,	0
LA RM120NIS DComponents	INFRARED LED,850NM,25MW,50MA,120	0
LA UZ307P2 DComponents	UV LED DIE, 275NM,18MW,100MA,750	200
LA CI13WP3 DComponents	INFRARED LED DIE,730NM,8MW,20MA,	0
LA TM120PIS DComponents	INFRARED LED,1050NM,3MW,20MA,120	0
LA NI12WP5 DComponents	INFRARED LED DIE,850NM,50MW,70MA	8161
LA NI12WP4 DComponents	INFRARED LED DIE,850NM,50MW,100M	433994

LED Emitters - Infrared, UV, Visible

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light. The categories of infrared (IR), ultraviolet (UV), and visible LEDs are differentiated by their emission wavelengths. These devices play critical roles in modern technology, enabling applications from communication systems to medical diagnostics, with advantages including energy efficiency, compact size, and long operational lifetimes.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Infrared LEDs	850-940 nm wavelength, low power consumption, invisible emission	Remote controls, night vision cameras, optical sensors
UV LEDs	280-400 nm wavelength, germicidal properties, high photon energy	Water purification, counterfeit detection, medical disinfection
Visible LEDs	400-700 nm wavelength, high brightness, color tunability	Lighting, displays, automotive indicators

3. Structure and Composition

LED emitters typically consist of: - Die: Semiconductor material (e.g., GaAs for IR, AlGaN for UV, InGaN for visible) - Substrate: Sapphire or silicon carbide for mechanical support - Encapsulation: Epoxy or silicone lens for light extraction and protection - Contact Layers: Metal electrodes for electrical connection - Thermal Pad: For heat dissipation in high-power devices

4. Key Technical Specifications

Parameter	Description	Importance
Wavelength ( )	Peak emission spectrum	Determines application suitability
Optical Power	Light output (mW or W)	Performance in sensing/illumination
Efficiency (W/W)	Electrical-to-optical conversion rate	Energy consumption and thermal management
Viewing Angle	Light emission spread ( )	Optical design flexibility
Operating Temperature	-40 C to +125 C range	Reliability in harsh environments

5. Application Fields

Major industries include: - Consumer Electronics: Smartphones (proximity sensors), TVs (backlighting) - Healthcare: Pulse oximeters (IR), sterilization equipment (UV) - Industrial: Machine vision systems (visible), chemical detection (UV) - Security: Surveillance cameras (IR), document authentication (UV) - Automotive: Brake lights (visible), LiDAR systems (IR)

6. Leading Manufacturers and Products

Manufacturer	Product Examples	Key Features
OSRAM Opto	SFH 4715A (IR)	940 nm, 1.5 W radiant power
Cree LED	UV5T-3535 (UV)	365 nm, 120 mW output
Nichia Corporation	NCSxW215BS (Visible)	White LED with 215 lm output

7. Selection Recommendations

Key factors include: - Spectral matching to target application (e.g., 280-320 nm for DNA analysis) - Thermal management requirements (e.g., heatsinks for >1 W devices) - Environmental conditions (e.g., IP67 rating for outdoor use) - Cost vs. performance tradeoffs (e.g., high-efficiency UV LEDs for sterilization) - Compatibility with drive electronics (current/voltage specifications)

8. Industry Trends

Emerging developments: - Miniaturization for wearable devices (e.g., sub-1 mm IR LEDs) - Increased UV-C efficiency (targeting 10% wall-plug efficiency) - Integration with IoT systems (smart lighting networks) - Advancements in phosphor conversion for visible LEDs - Wide bandgap semiconductor adoption (GaN-on-SiC substrates) - Environmental regulations driving mercury-free UV solutions