LED Emitters - Infrared, UV, Visible

Image Part Number Description / PDF Quantity Rfq
VAOL-5GUV0T4

VAOL-5GUV0T4

Visual Communications Company, LLC

EMITTER UV 405NM 30MA RADIAL

8414

VAOL-3GUV0Y4

VAOL-3GUV0Y4

Visual Communications Company, LLC

EMITTER UV 405NM 30MA RADIAL

3879

VAOL-5GUV8T4

VAOL-5GUV8T4

Visual Communications Company, LLC

EMITTER UV 385NM 30MA RADIAL

8683

VAOL-5EUV0T4

VAOL-5EUV0T4

Visual Communications Company, LLC

EMITTER UV 405NM 30MA RADIAL

4350

VAOL-3EUV0Y4

VAOL-3EUV0Y4

Visual Communications Company, LLC

EMITTER UV 405NM 30MA RADIAL

415

VAOL-5EUV8T4

VAOL-5EUV8T4

Visual Communications Company, LLC

EMITTER UV 385NM 30MA RADIAL

917

VAOL-3EUV8Y4

VAOL-3EUV8Y4

Visual Communications Company, LLC

EMITTER UV 385NM 30MA RADIAL

0

LED Emitters - Infrared, UV, Visible

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light. The categories of infrared (IR), ultraviolet (UV), and visible LEDs are differentiated by their emission wavelengths. These devices play critical roles in modern technology, enabling applications from communication systems to medical diagnostics, with advantages including energy efficiency, compact size, and long operational lifetimes.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Infrared LEDs850-940 nm wavelength, low power consumption, invisible emissionRemote controls, night vision cameras, optical sensors
UV LEDs280-400 nm wavelength, germicidal properties, high photon energyWater purification, counterfeit detection, medical disinfection
Visible LEDs400-700 nm wavelength, high brightness, color tunabilityLighting, displays, automotive indicators

3. Structure and Composition

LED emitters typically consist of: - Die: Semiconductor material (e.g., GaAs for IR, AlGaN for UV, InGaN for visible) - Substrate: Sapphire or silicon carbide for mechanical support - Encapsulation: Epoxy or silicone lens for light extraction and protection - Contact Layers: Metal electrodes for electrical connection - Thermal Pad: For heat dissipation in high-power devices

4. Key Technical Specifications

ParameterDescriptionImportance
Wavelength ( )Peak emission spectrumDetermines application suitability
Optical PowerLight output (mW or W)Performance in sensing/illumination
Efficiency (W/W)Electrical-to-optical conversion rateEnergy consumption and thermal management
Viewing AngleLight emission spread ( )Optical design flexibility
Operating Temperature-40 C to +125 C rangeReliability in harsh environments

5. Application Fields

Major industries include: - Consumer Electronics: Smartphones (proximity sensors), TVs (backlighting) - Healthcare: Pulse oximeters (IR), sterilization equipment (UV) - Industrial: Machine vision systems (visible), chemical detection (UV) - Security: Surveillance cameras (IR), document authentication (UV) - Automotive: Brake lights (visible), LiDAR systems (IR)

6. Leading Manufacturers and Products

ManufacturerProduct ExamplesKey Features
OSRAM OptoSFH 4715A (IR)940 nm, 1.5 W radiant power
Cree LEDUV5T-3535 (UV)365 nm, 120 mW output
Nichia CorporationNCSxW215BS (Visible)White LED with 215 lm output

7. Selection Recommendations

Key factors include: - Spectral matching to target application (e.g., 280-320 nm for DNA analysis) - Thermal management requirements (e.g., heatsinks for >1 W devices) - Environmental conditions (e.g., IP67 rating for outdoor use) - Cost vs. performance tradeoffs (e.g., high-efficiency UV LEDs for sterilization) - Compatibility with drive electronics (current/voltage specifications)

8. Industry Trends

Emerging developments: - Miniaturization for wearable devices (e.g., sub-1 mm IR LEDs) - Increased UV-C efficiency (targeting 10% wall-plug efficiency) - Integration with IoT systems (smart lighting networks) - Advancements in phosphor conversion for visible LEDs - Wide bandgap semiconductor adoption (GaN-on-SiC substrates) - Environmental regulations driving mercury-free UV solutions

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