Laser Diodes, Laser Modules

Image Part Number Description / PDF Quantity Rfq
M6355I

M6355I

US-Lasers, Inc.

LASER DIODE 635NM 5MW 10.4MM DIA

14

MM650-5 W/SPRING

MM650-5 W/SPRING

US-Lasers, Inc.

LASER DIODE 650NM 6.4MM DIA

0

M8085I

M8085I

US-Lasers, Inc.

LASER DIODE 808NM 5MW 10.4MM DIA

8

M6505I

M6505I

US-Lasers, Inc.

LASER DIODE 655NM 5MW 10.4MM DIA

29

33D840-5

33D840-5

US-Lasers, Inc.

LASER DIODE 840NM 5MW MODULE

0

M850-30

M850-30

US-Lasers, Inc.

LASER DIODE 850NM 10.4MM DIA

0

D904-5-5.6

D904-5-5.6

US-Lasers, Inc.

LASER DIODE 904NM 5MW TO18

0

D850-15I

D850-15I

US-Lasers, Inc.

LASER DIODE 850NM 15MW TO18

0

M780-10

M780-10

US-Lasers, Inc.

LASER DIODE 780NM 10MW 10.4MM

0

33D780-5

33D780-5

US-Lasers, Inc.

LASER DIODE 780NM 5MW MODULE

0

MM6605I

MM6605I

US-Lasers, Inc.

LASER DIODE 660NM 5MW 6.4MM DIA

0

VOL6605I

VOL6605I

US-Lasers, Inc.

LASER DIODE 660NM 4.8MW 10.4MM

0

M6605I

M6605I

US-Lasers, Inc.

LASER DIODE 660NM 5MW 10.4MM DIA

0

MM6405I

MM6405I

US-Lasers, Inc.

LASER DIODE 640NM 5MW 6.4MM DIA

0

M6405I

M6405I

US-Lasers, Inc.

LASER DIODE 640NM 5MW 10.4MM DIA

0

VOL6405I

VOL6405I

US-Lasers, Inc.

LASER DIODE 640NM 4.8MW 10.4MM

0

D6605I

D6605I

US-Lasers, Inc.

LASER DIODE 660NM 5MW TO18

0

M6610I

M6610I

US-Lasers, Inc.

LASER DIODE 660NM 10MW 10.4MM

0

Laser Diodes, Laser Modules

1. Overview

Laser diodes (LDs) are semiconductor devices that emit coherent light through stimulated emission. Laser modules integrate LDs with optical components, drivers, and thermal management systems. These devices are critical in telecommunications, medical systems, industrial processing, and consumer electronics due to their high efficiency, compact size, and precise beam control.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Edge-Emitting Laser DiodesHigh power output, narrow spectral widthFiber optic communication, LIDAR
Vertical-Cavity Surface-Emitting Lasers (VCSELs)Low divergence beam, array scalability3D sensing, data centers
Quantum Cascade LasersTunable mid-infrared emissionGas sensing, spectroscopy
Fiber-Coupled Laser ModulesIntegrated beam shaping, wavelength stabilizationMaterial processing, medical surgery
Multi-Transverse Mode LasersHigh brightness, multimode outputLaser projection, defense systems

3. Structure and Components

Laser Diodes: Composed of an active region (quantum well structure), cladding layers, and a resonant cavity formed by cleaved facets. Electrical contacts enable current injection.

Laser Modules: Integrate LDs with:

  • Collimating optics and beam-shaping elements
  • Photodiode feedback for power stabilization
  • Thermoelectric coolers (TEC) for temperature control
  • Driver circuits with modulation capabilities

4. Key Technical Specifications

ParameterDescriptionImportance
Wavelength (nm)Emission spectrum peakDetermines material compatibility and application suitability
Output Power (mW/W)Optical power levelCritical for processing speed and transmission distance
Wall-Plug Efficiency (%)Electrical-to-optical conversion rateAffects thermal management and power consumption
Beam Quality (M )Deviatoin from ideal Gaussian beamImpacts focusing precision and coupling efficiency
Lifetime (hours)Mean time before power 10%System reliability and maintenance intervals

5. Application Fields

Telecommunications: DWDM systems, free-space optical links

Medical: Laser scalpels, photodynamic therapy devices

Industrial: Cutting/welding machines, 3D printers

Consumer Electronics: LiDAR for AR/VR, facial recognition systems

Scientific: Atomic clocks, quantum computing research

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
LumentumLD-XX-Y Series1550nm wavelength, 100mW output, telecom-grade reliability
IPG PhotonicsLM-ABC-10WSingle-mode fiber delivery, 10W output at 976nm
CoherentOBIS Flexx SeriesTunable visible/near-IR output, integrated control
Hamamatsu PhotonicsL8612 SeriesPulsed VCSEL with 940nm peak wavelength

7. Selection Guidelines

Key considerations:

  • Wavelength compatibility with target material/transmission medium
  • Required power stability over temperature variations
  • Modulation speed requirements for communication systems
  • Environmental factors (humidity, vibration, operating temperature)
  • Form factor constraints and cooling method availability

8. Industry Trends

Emerging developments include:

  • High-power single-mode fiber lasers for metal processing
  • VCSEL arrays with >50% wall-plug efficiency for LiDAR
  • Photonic integrated circuits combining LDs with modulators
  • UV and deep-IR emitting devices for advanced spectroscopy
  • AI-driven thermal management systems for extended lifetime

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