Laser Diodes, Laser Modules

Image Part Number Description / PDF Quantity Rfq
GH06550B2B

GH06550B2B

Sharp Microelectronics

LASER DIODE 654NM 50MW TO18

0

GH0781JA2C

GH0781JA2C

Sharp Microelectronics

LASER DIODE 784NM 120MW TO18

0

GH06510B2A

GH06510B2A

Sharp Microelectronics

LASER DIODE 654NM 10MW TO18

0

GH04P21A2GE

GH04P21A2GE

Sharp Microelectronics

LASER DIODE 406NM 105MW TO18

0

GH06507B2A

GH06507B2A

Sharp Microelectronics

LASER DIODE 654NM 7MW TO18

0

GH04125A2A

GH04125A2A

Sharp Microelectronics

LASER DIODE 406NM 130MW TO18

0

GH06560B2C

GH06560B2C

Sharp Microelectronics

LASER DIODE 658NM 60MW TO18

0

GH04020B2A

GH04020B2A

Sharp Microelectronics

LASER DIODE 406NM 20MW TO18

0

Laser Diodes, Laser Modules

1. Overview

Laser diodes (LDs) are semiconductor devices that emit coherent light through stimulated emission. Laser modules integrate LDs with optical components, drivers, and thermal management systems. These devices are critical in telecommunications, medical systems, industrial processing, and consumer electronics due to their high efficiency, compact size, and precise beam control.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Edge-Emitting Laser DiodesHigh power output, narrow spectral widthFiber optic communication, LIDAR
Vertical-Cavity Surface-Emitting Lasers (VCSELs)Low divergence beam, array scalability3D sensing, data centers
Quantum Cascade LasersTunable mid-infrared emissionGas sensing, spectroscopy
Fiber-Coupled Laser ModulesIntegrated beam shaping, wavelength stabilizationMaterial processing, medical surgery
Multi-Transverse Mode LasersHigh brightness, multimode outputLaser projection, defense systems

3. Structure and Components

Laser Diodes: Composed of an active region (quantum well structure), cladding layers, and a resonant cavity formed by cleaved facets. Electrical contacts enable current injection.

Laser Modules: Integrate LDs with:

  • Collimating optics and beam-shaping elements
  • Photodiode feedback for power stabilization
  • Thermoelectric coolers (TEC) for temperature control
  • Driver circuits with modulation capabilities

4. Key Technical Specifications

ParameterDescriptionImportance
Wavelength (nm)Emission spectrum peakDetermines material compatibility and application suitability
Output Power (mW/W)Optical power levelCritical for processing speed and transmission distance
Wall-Plug Efficiency (%)Electrical-to-optical conversion rateAffects thermal management and power consumption
Beam Quality (M )Deviatoin from ideal Gaussian beamImpacts focusing precision and coupling efficiency
Lifetime (hours)Mean time before power 10%System reliability and maintenance intervals

5. Application Fields

Telecommunications: DWDM systems, free-space optical links

Medical: Laser scalpels, photodynamic therapy devices

Industrial: Cutting/welding machines, 3D printers

Consumer Electronics: LiDAR for AR/VR, facial recognition systems

Scientific: Atomic clocks, quantum computing research

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
LumentumLD-XX-Y Series1550nm wavelength, 100mW output, telecom-grade reliability
IPG PhotonicsLM-ABC-10WSingle-mode fiber delivery, 10W output at 976nm
CoherentOBIS Flexx SeriesTunable visible/near-IR output, integrated control
Hamamatsu PhotonicsL8612 SeriesPulsed VCSEL with 940nm peak wavelength

7. Selection Guidelines

Key considerations:

  • Wavelength compatibility with target material/transmission medium
  • Required power stability over temperature variations
  • Modulation speed requirements for communication systems
  • Environmental factors (humidity, vibration, operating temperature)
  • Form factor constraints and cooling method availability

8. Industry Trends

Emerging developments include:

  • High-power single-mode fiber lasers for metal processing
  • VCSEL arrays with >50% wall-plug efficiency for LiDAR
  • Photonic integrated circuits combining LDs with modulators
  • UV and deep-IR emitting devices for advanced spectroscopy
  • AI-driven thermal management systems for extended lifetime

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