Fiber Optics - Transmitters - Drive Circuitry Integrated

Part Number	Description / PDF	Quantity
PLT133/T10W Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	13048
EAPLTAA4 Everlight Electronics	PHOTO-LINK TRANSMITTER MODULE	0
PLT133/T8 Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T2 Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T7 Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
EAPLTAA6 Everlight Electronics	TRANSMITTER MODULE	0
PLT133/T9 Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T6A Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT131/T5/6P Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT131/T5/8P Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT237/L5/T8 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT131/T6/12 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT237/L5/T9 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT133/T5P Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T9B Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT131/T8/8 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT132F/T11 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0
PLT133/T5A Everlight Electronics	TRANSMITTER FBR OPT IR PHOTOLINK	0
PLT133/T10 Everlight Electronics	FIBER OPTIC TRANSMITTER IR	0

Fiber Optics - Transmitters - Drive Circuitry Integrated

1. Overview

Integrated Drive Circuitry Transmitters (IDCTs) combine optical source components (e.g., laser diodes or LEDs) with driver electronics in a single package. These devices convert electrical signals into modulated optical signals for fiber optic communication systems. Their integration reduces design complexity, improves signal integrity, and enhances reliability in high-speed data transmission applications such as telecommunications, data centers, and industrial sensing.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Direct Modulation IDCT	Modulates laser current directly; cost-effective for short-reach links	Ethernet switches, campus networks
External Modulation IDCT	Uses separate modulator for higher speed/quality; supports advanced formats	Long-haul telecom, 400G+ systems
WDM IDCT	Integrates wavelength division multiplexing; supports multiple channels	Data center interconnects, FTTH networks
High-Power IDCT	Delivers >100mW output; includes thermal management	Industrial sensing, defense systems

3. Structure and Components

A typical IDCT consists of: - Optical Source: Fabry-P rot or DFB laser diodes, VCSELs, or LEDs - Driver IC: Implements modulation (NRZ/PAM4), APC (Automatic Power Control), and thermal compensation - Optical Interface: SC/LC connectors or MT ferrules - Thermal Management: TEC (Thermoelectric Cooler) for wavelength stability - Housing: Metal/glass hermetic packages with EMI shielding

4. Key Technical Specifications

Parameter	Importance	Typical Range
Data Rate	Determines bandwidth capacity	100Mbps 800Gbps
Wavelength	Affects fiber dispersion and loss	850nm 1650nm
Output Power	Impacts transmission distance	-10dBm +20dBm
Extinction Ratio	Measures modulation contrast	8 30dB
Power Consumption	Impacts thermal design	0.5W 10W
Operating Temperature	Defines environmental tolerance	0 C 85 C

5. Application Areas

Telecommunications: 5G fronthaul/backhaul, DWDM core networks
Data Centers: 100G/400G QSFP transceivers, switch interconnects
Industrial: Harsh-environment sensors, factory automation
Medical: Endoscopy imaging systems, patient monitoring

Case Study: In 400G data center links, Lumentum's IDCT modules enable 4 100G transmission over single-mode fiber with PAM4 modulation, achieving 2km reach at 1550nm wavelength.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Finisar (II-VI)	FMLB-4221-01	100G CFP4 LR4, 1310nm WDM
Lumentum	LD-9802-BB	800Gbps external modulation, O-band
Avago (Broadcom)	HFBR-1591	Industrial-grade 160MBd, 650nm LED
Sumitomo Electric	L9557-01	High-power 1550nm, 200mW output

7. Selection Guidelines

Key considerations include: - Match data rate and modulation format to system requirements - Verify wavelength compatibility with existing fiber infrastructure - Evaluate thermal management needs for target environment - Balance output power vs. power consumption constraints - Choose form factor (e.g., SFP, CFP, custom) based on space limitations - Consider reliability specifications (MTBF >1M hours typical)

8. Industry Trends

Future developments focus on: - Migration to 1.6Tbps+ with advanced modulation (PAM4, QAM) - Silicon photonics integration for cost reduction - Co-packaged optics with switches for AI/ML workloads - Enhanced thermal efficiency for 5G distributed units - Adoption of O-band (1260 1360nm) for reduced dispersion in short-reach systems