Fiber Optics - Transmitters - Drive Circuitry Integrated

Image Part Number Description / PDF Quantity Rfq
1656L055

1656L055

Broadcom

10G DWDM TOSA 80KM LC RECEPTACLE

0

1655L159

1655L159

Broadcom

TRANSMITTER TOSA

0

1625L8C49

1625L8C49

Broadcom

TRANSMITTER TOSA

0

1608L336

1608L336

Broadcom

TRANSMITTER TOSA

0

1625F050

1625F050

Broadcom

TRANSMITTER TOSA

0

1611L2891

1611L2891

Broadcom

TRANSMITTER TOSA

0

1610L1896

1610L1896

Broadcom

TRANSMITTER TOSA

0

1625L331

1625L331

Broadcom

10G DWDM TOSA 40KM LC RECEPTACLE

0

1626L437

1626L437

Broadcom

TRANSMITTER TOSA

0

1610L031

1610L031

Broadcom

2.5G DWDM TOSA 120KM LC REC

0

1611F332

1611F332

Broadcom

TRANSMITTER TOSA

0

1656L3T

1656L3T

Broadcom

TRANSMITTER TOSA

0

1626L746

1626L746

Broadcom

TRANSMITTER TOSA

0

1610L751

1610L751

Broadcom

TRANSMITTER TOSA

0

648C42

648C42

Broadcom

TOSA

0

1608L133

1608L133

Broadcom

4.25G DWDM TOSA 80KM

0

1611L818

1611L818

Broadcom

TRANSMITTER TOSA

0

342A17

342A17

Broadcom

TOSA

0

1611L236

1611L236

Broadcom

TRANSMITTER TOSA

0

1655L027

1655L027

Broadcom

10G DWDM TOSA 40KM LC RECEPTACLE

0

Fiber Optics - Transmitters - Drive Circuitry Integrated

1. Overview

Integrated Drive Circuitry Transmitters (IDCTs) combine optical source components (e.g., laser diodes or LEDs) with driver electronics in a single package. These devices convert electrical signals into modulated optical signals for fiber optic communication systems. Their integration reduces design complexity, improves signal integrity, and enhances reliability in high-speed data transmission applications such as telecommunications, data centers, and industrial sensing.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Direct Modulation IDCTModulates laser current directly; cost-effective for short-reach linksEthernet switches, campus networks
External Modulation IDCTUses separate modulator for higher speed/quality; supports advanced formatsLong-haul telecom, 400G+ systems
WDM IDCTIntegrates wavelength division multiplexing; supports multiple channelsData center interconnects, FTTH networks
High-Power IDCTDelivers >100mW output; includes thermal managementIndustrial sensing, defense systems

3. Structure and Components

A typical IDCT consists of: - Optical Source: Fabry-P rot or DFB laser diodes, VCSELs, or LEDs - Driver IC: Implements modulation (NRZ/PAM4), APC (Automatic Power Control), and thermal compensation - Optical Interface: SC/LC connectors or MT ferrules - Thermal Management: TEC (Thermoelectric Cooler) for wavelength stability - Housing: Metal/glass hermetic packages with EMI shielding

4. Key Technical Specifications

ParameterImportanceTypical Range
Data RateDetermines bandwidth capacity100Mbps 800Gbps
WavelengthAffects fiber dispersion and loss850nm 1650nm
Output PowerImpacts transmission distance-10dBm +20dBm
Extinction RatioMeasures modulation contrast8 30dB
Power ConsumptionImpacts thermal design0.5W 10W
Operating TemperatureDefines environmental tolerance0 C 85 C

5. Application Areas

  • Telecommunications: 5G fronthaul/backhaul, DWDM core networks
  • Data Centers: 100G/400G QSFP transceivers, switch interconnects
  • Industrial: Harsh-environment sensors, factory automation
  • Medical: Endoscopy imaging systems, patient monitoring

Case Study: In 400G data center links, Lumentum's IDCT modules enable 4 100G transmission over single-mode fiber with PAM4 modulation, achieving 2km reach at 1550nm wavelength.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Finisar (II-VI)FMLB-4221-01100G CFP4 LR4, 1310nm WDM
LumentumLD-9802-BB800Gbps external modulation, O-band
Avago (Broadcom)HFBR-1591Industrial-grade 160MBd, 650nm LED
Sumitomo ElectricL9557-01High-power 1550nm, 200mW output

7. Selection Guidelines

Key considerations include: - Match data rate and modulation format to system requirements - Verify wavelength compatibility with existing fiber infrastructure - Evaluate thermal management needs for target environment - Balance output power vs. power consumption constraints - Choose form factor (e.g., SFP, CFP, custom) based on space limitations - Consider reliability specifications (MTBF >1M hours typical)

8. Industry Trends

Future developments focus on: - Migration to 1.6Tbps+ with advanced modulation (PAM4, QAM) - Silicon photonics integration for cost reduction - Co-packaged optics with switches for AI/ML workloads - Enhanced thermal efficiency for 5G distributed units - Adoption of O-band (1260 1360nm) for reduced dispersion in short-reach systems

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