| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Excelitas Technologies |
KINEFLEX-H-2-488..640-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-1-445-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-561-0.7-APC-0 |
0 |
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Excelitas Technologies |
KINEFLEX-1-514-0.7-FCP8-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-2-640-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-532-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-445-0.7-FCP-0 |
0 |
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Excelitas Technologies |
KINEFLEX-2-514-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-640-0.7-FCP8-0 |
0 |
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Excelitas Technologies |
KINEFLEX-H-1-514-0.7-FCP8-0 |
0 |
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Excelitas Technologies |
KINEFLEX-H-2-405-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-2-514-0.7-0.7-0 |
0 |
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Excelitas Technologies |
KINEFLEX-H-1-640-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-2-405-0.7-APC-0 |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-405..640-0.7-APC-0 |
0 |
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Excelitas Technologies |
KINEFLEX-H-1-532-0.7-APC-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-3-488-0.7-0.7-P |
0 |
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Excelitas Technologies |
KINEFLEX-H-1-514-0.7-0.7-P |
0 |
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Sharp Microelectronics |
TRANSMITTER FIBER OPTIC 13.2MBPS |
0 |
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Omron Electronics Components |
MODULE FIBER OPTIC XMIT 14GB |
0 |
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Integrated Drive Circuitry Transmitters (IDCTs) combine optical source components (e.g., laser diodes or LEDs) with driver electronics in a single package. These devices convert electrical signals into modulated optical signals for fiber optic communication systems. Their integration reduces design complexity, improves signal integrity, and enhances reliability in high-speed data transmission applications such as telecommunications, data centers, and industrial sensing.
| Type | Functional Features | Application Examples |
|---|---|---|
| Direct Modulation IDCT | Modulates laser current directly; cost-effective for short-reach links | Ethernet switches, campus networks |
| External Modulation IDCT | Uses separate modulator for higher speed/quality; supports advanced formats | Long-haul telecom, 400G+ systems |
| WDM IDCT | Integrates wavelength division multiplexing; supports multiple channels | Data center interconnects, FTTH networks |
| High-Power IDCT | Delivers >100mW output; includes thermal management | Industrial sensing, defense systems |
A typical IDCT consists of: - Optical Source: Fabry-P rot or DFB laser diodes, VCSELs, or LEDs - Driver IC: Implements modulation (NRZ/PAM4), APC (Automatic Power Control), and thermal compensation - Optical Interface: SC/LC connectors or MT ferrules - Thermal Management: TEC (Thermoelectric Cooler) for wavelength stability - Housing: Metal/glass hermetic packages with EMI shielding
| Parameter | Importance | Typical Range |
|---|---|---|
| Data Rate | Determines bandwidth capacity | 100Mbps 800Gbps |
| Wavelength | Affects fiber dispersion and loss | 850nm 1650nm |
| Output Power | Impacts transmission distance | -10dBm +20dBm |
| Extinction Ratio | Measures modulation contrast | 8 30dB |
| Power Consumption | Impacts thermal design | 0.5W 10W |
| Operating Temperature | Defines environmental tolerance | 0 C 85 C |
Case Study: In 400G data center links, Lumentum's IDCT modules enable 4 100G transmission over single-mode fiber with PAM4 modulation, achieving 2km reach at 1550nm wavelength.
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Finisar (II-VI) | FMLB-4221-01 | 100G CFP4 LR4, 1310nm WDM |
| Lumentum | LD-9802-BB | 800Gbps external modulation, O-band |
| Avago (Broadcom) | HFBR-1591 | Industrial-grade 160MBd, 650nm LED |
| Sumitomo Electric | L9557-01 | High-power 1550nm, 200mW output |
Key considerations include: - Match data rate and modulation format to system requirements - Verify wavelength compatibility with existing fiber infrastructure - Evaluate thermal management needs for target environment - Balance output power vs. power consumption constraints - Choose form factor (e.g., SFP, CFP, custom) based on space limitations - Consider reliability specifications (MTBF >1M hours typical)
Future developments focus on: - Migration to 1.6Tbps+ with advanced modulation (PAM4, QAM) - Silicon photonics integration for cost reduction - Co-packaged optics with switches for AI/ML workloads - Enhanced thermal efficiency for 5G distributed units - Adoption of O-band (1260 1360nm) for reduced dispersion in short-reach systems