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TRANSCEIVER |
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TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
TRANSCEIVER |
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Foxconn OE Technologies |
MINIPOD TX ROUND NO HEATSINK |
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Foxconn OE Technologies |
MINIPOD TX FLAT HEATSINK 100M |
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Foxconn OE Technologies |
MINIPOD 5G TX RND HEATSINK 100M |
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Foxconn OE Technologies |
12X10G TX ROUND CBL PKG MECH |
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Foxconn OE Technologies |
MINIPOD TX FLAT HEATSINK 100M |
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Foxconn OE Technologies |
MINIPOD TX FLAT HEATSINK 300M |
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Discrete fiber optic transmitters are optoelectronic devices that convert electrical signals into optical signals through individual component packages. They serve as fundamental building blocks in fiber communication systems, enabling data transmission via modulated light waves. These transmitters play critical roles in telecommunications, data centers, and sensing applications due to their high bandwidth efficiency and electromagnetic interference immunity.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| LED Transmitters | Low-cost, low-power, broad spectral width | Short-distance links ( 2km), premises networks |
| Laser Diodes (LD) | High power, narrow linewidth, high speed | Long-haul telecom, CATV systems |
| VCSELs | Low divergence beam, low power consumption | Data center interconnects (100G-400G) |
| Electro-absorption Modulated Lasers (EML) | Integrated modulation, low chirp | High-speed DWDM systems ( 100Gbps) |
Typical discrete transmitters consist of: (1) Light source (LED/LD/VCSEL chip), (2) Optical sub-assembly (OSA) with lens/filter, (3) Electrical interface (bonding wires/PCB), (4) Hermetic package (TO-can or surface-mount). Advanced designs integrate drivers/modulators in photonic integrated circuits (PICs).
| Parameter | Significance |
|---|---|
| Wavelength (1270-1610nm) | Determines fiber transmission window and dispersion characteristics |
| Output Power (-20 to +20dBm) | Affects transmission distance and signal-to-noise ratio |
| Modulation Bandwidth (DC-67GHz) | Limits maximum data rate capability |
| Chirp Characteristics | Impacts dispersion penalty in high-speed systems |
| Operating Temperature (-40 to +85 C) | Determines environmental deployment flexibility |
Primary industries include: Telecommunications (DWDM networks), Data Centers (QSFP modules), Cable TV (HFC networks), Industrial Sensing (strain/temperature monitoring). Typical equipment: Optical line terminals (OLTs), active optical cables (AOCs), OTDR test instruments.
| Vendor | Representative Product |
|---|---|
| II-VI Incorporated | 100G CFP EML transmitter |
| Lumentum | Multi-junction VCSEL arrays |
| Finisar (II-VI) | TO-Can DFB lasers |
| Broadcom | Integrated TOSA assemblies |
| NeoPhotonics | High-power narrow-linewidth lasers |
Key considerations: (1) Match wavelength to system requirements (O-band/C-band), (2) Verify output power vs. link budget needs, (3) Ensure modulation bandwidth exceeds data rate requirements, (4) Evaluate thermal stability for operating environments, (5) Consider packaging form factor (TO/ROSA vs. SMT), (6) Balance cost/performance for volume deployments.
Current development directions include: (1) 400G+ transmission through advanced modulation formats, (2) Silicon photonics integration for cost reduction, (3) Shortwave infrared (SWIR) sources for emerging applications, (4) AI-driven digital signal processing co-design, (5) Environmental compliance with RoHS/Green Photonics initiatives. Market growth in 5G fronthaul and automotive LiDAR applications is driving innovation in compact, low-power transmitters.