Fiber Optics - Transmitters - Discrete

Image Part Number Description / PDF Quantity Rfq
V850-2224-004

V850-2224-004

Finisar Corporation

PHOTODIODE

0

V880-2257-002

V880-2257-002

Finisar Corporation

PHOTODIODE

0

V850-2368-900

V850-2368-900

Finisar Corporation

PHOTODIODE

0

AFBR-815RN1Z

AFBR-815RN1Z

Foxconn OE Technologies

MINIPOD TX ROUND NO HEATSINK

0

V880-2257-003

V880-2257-003

Finisar Corporation

PHOTODIODE

0

V850-2173-003

V850-2173-003

Finisar Corporation

PHOTODIODE

0

V910-2258-002

V910-2258-002

Finisar Corporation

PHOTODIODE

0

HFBR-779BHWZ

HFBR-779BHWZ

Broadcom

XMITTER 12X2.7GBD 62.5UM FO

0

OPF692-2

OPF692-2

TT Electronics / Optek Technology

LED PHOTOSENSOR PAIR SIDE LOOK

0

OPF672-2

OPF672-2

TT Electronics / Optek Technology

LED FIBER OPTIC TO46

0

HFBR-779BEWZ

HFBR-779BEWZ

Broadcom

XMITTER 12X2.7GBD 62.5UM FO

0

OPF370C

OPF370C

TT Electronics / Optek Technology

LED FIBER OPTC GAAIAS HS TO-19

0

PDI-E520

PDI-E520

Luna Optoelectronics (Advanced Photonix)

EMITTER FIBER OPTIC 950NM PLASTC

0

V850-2225-001

V850-2225-001

Finisar Corporation

PHOTODIODE

0

OPF340C

OPF340C

TT Electronics / Optek Technology

LED FIBER OPTIC GAAIAS HS TO-46

0

OPF392B

OPF392B

TT Electronics / Optek Technology

LED FIBER OPTC GAAIAS HS TO18 ST

0

HFE4070-500-ADA

HFE4070-500-ADA

Honeywell Sensing and Productivity Solutions

LED 850NM GAALAS 4HOLE SMA

0

HFM5500-BBF

HFM5500-BBF

Honeywell Sensing and Productivity Solutions

HOST MODEM RS232 FIBER OPTIC

0

PCWDM-4X10G-MMF-LC

PCWDM-4X10G-MMF-LC

Finisar Corporation

PHOTODIODE

0

OPF397C

OPF397C

TT Electronics / Optek Technology

LED FIBR OPTC HS GAAIAS TO-18 ST

0

Fiber Optics - Transmitters - Discrete

1. Overview

Discrete fiber optic transmitters are optoelectronic devices that convert electrical signals into optical signals through individual component packages. They serve as fundamental building blocks in fiber communication systems, enabling data transmission via modulated light waves. These transmitters play critical roles in telecommunications, data centers, and sensing applications due to their high bandwidth efficiency and electromagnetic interference immunity.

2. Major Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
LED TransmittersLow-cost, low-power, broad spectral widthShort-distance links ( 2km), premises networks
Laser Diodes (LD)High power, narrow linewidth, high speedLong-haul telecom, CATV systems
VCSELsLow divergence beam, low power consumptionData center interconnects (100G-400G)
Electro-absorption Modulated Lasers (EML)Integrated modulation, low chirpHigh-speed DWDM systems ( 100Gbps)

3. Structure & Components

Typical discrete transmitters consist of: (1) Light source (LED/LD/VCSEL chip), (2) Optical sub-assembly (OSA) with lens/filter, (3) Electrical interface (bonding wires/PCB), (4) Hermetic package (TO-can or surface-mount). Advanced designs integrate drivers/modulators in photonic integrated circuits (PICs).

4. Key Technical Specifications

ParameterSignificance
Wavelength (1270-1610nm)Determines fiber transmission window and dispersion characteristics
Output Power (-20 to +20dBm)Affects transmission distance and signal-to-noise ratio
Modulation Bandwidth (DC-67GHz)Limits maximum data rate capability
Chirp CharacteristicsImpacts dispersion penalty in high-speed systems
Operating Temperature (-40 to +85 C)Determines environmental deployment flexibility

5. Application Domains

Primary industries include: Telecommunications (DWDM networks), Data Centers (QSFP modules), Cable TV (HFC networks), Industrial Sensing (strain/temperature monitoring). Typical equipment: Optical line terminals (OLTs), active optical cables (AOCs), OTDR test instruments.

6. Leading Manufacturers & Products

VendorRepresentative Product
II-VI Incorporated100G CFP EML transmitter
LumentumMulti-junction VCSEL arrays
Finisar (II-VI)TO-Can DFB lasers
BroadcomIntegrated TOSA assemblies
NeoPhotonicsHigh-power narrow-linewidth lasers

7. Selection Guidelines

Key considerations: (1) Match wavelength to system requirements (O-band/C-band), (2) Verify output power vs. link budget needs, (3) Ensure modulation bandwidth exceeds data rate requirements, (4) Evaluate thermal stability for operating environments, (5) Consider packaging form factor (TO/ROSA vs. SMT), (6) Balance cost/performance for volume deployments.

8. Industry Trends

Current development directions include: (1) 400G+ transmission through advanced modulation formats, (2) Silicon photonics integration for cost reduction, (3) Shortwave infrared (SWIR) sources for emerging applications, (4) AI-driven digital signal processing co-design, (5) Environmental compliance with RoHS/Green Photonics initiatives. Market growth in 5G fronthaul and automotive LiDAR applications is driving innovation in compact, low-power transmitters.

RFQ BOM Call Skype Email
Top