Accessories

Image Part Number Description / PDF Quantity Rfq
C13761_PF-SOCKET-CXA15

C13761_PF-SOCKET-CXA15

LEDiL

BASE RND 38MM DIA 2.33MM HT WHT

27

FP15490_HEKLA-A

FP15490_HEKLA-A

LEDiL

ASSY MM (D) MM(H)

80

C16491_XTM-ADAPTER-50-A

C16491_XTM-ADAPTER-50-A

LEDiL

BASE PART MM (D) MM(H)

62

C13708_PF-SOCKET-VERO10

C13708_PF-SOCKET-VERO10

LEDiL

BASE RND 38MM DIA 3MM HT WHITE

97

F15848_HEKLA-SOCKET-G

F15848_HEKLA-SOCKET-G

LEDiL

BASE PARTROUND1 POS44MM (D)5,5MM

107

F15859_HEKLA-SOCKET-I

F15859_HEKLA-SOCKET-I

LEDiL

BASE PARTROUND1 POS44MM (D)5,5MM

231

F15256_HEKLA-SOCKET-D

F15256_HEKLA-SOCKET-D

LEDiL

BASE PART ROUND 1 POS 44MM (D) 5

0

FP15957_HEKLA-J

FP15957_HEKLA-J

LEDiL

ASSY ROUND 44MM (D) 5,5MM(H)

8

C13709_PF-SOCKET-VERO13-18

C13709_PF-SOCKET-VERO13-18

LEDiL

BASE RND 38MM 2.2MM VERO10

22

F15956_HEKLA-SOCKET-J

F15956_HEKLA-SOCKET-J

LEDiL

BASE PARTROUND1 POS44MM (D)5,5MM

33

C13399_CLAMP-S5000

C13399_CLAMP-S5000

LEDiL

BASE PART 1POS 50MM D 10MM H

49

C13658_CLAMP-VERO13-18

C13658_CLAMP-VERO13-18

LEDiL

HOLDER RND 1POS 50MM D 9.25MM

38

C14751_FLORENCE-1R-CLIP-C

C14751_FLORENCE-1R-CLIP-C

LEDiL

ACCESSORY RECTANG 0 POS 48,7X9MM

0

F17435_HEKLA-G2-C

F17435_HEKLA-G2-C

LEDiL

BASE PARTMM (D)

0

FP15503_HEKLA-E

FP15503_HEKLA-E

LEDiL

ASSY MM (D) MM(H)

45

C16142_HEKLA-SOCKET-K

C16142_HEKLA-SOCKET-K

LEDiL

BASE PARTROUND1 POS44MM (D)5,5MM

0

FP15501_HEKLA-C

FP15501_HEKLA-C

LEDiL

ASSY MM (D) MM(H)

32

FP15500_HEKLA-B

FP15500_HEKLA-B

LEDiL

ASSY MM (D) MM(H)

41

FP15948_HEKLA-H

FP15948_HEKLA-H

LEDiL

ASSY ROUND 44MM (D) 5,5MM(H)

0

FP15949_HEKLA-I

FP15949_HEKLA-I

LEDiL

ASSY ROUND 44MM (D) 5,5MM(H)

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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