| Image | Part Number | Description / PDF | Quantity | Rfq |
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JKL Components Corporation |
LED LIGHT BAR STRIP WIRE HARNESS |
0 |
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JKL Components Corporation |
LED WIRE HARNESS 30" |
0 |
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JKL Components Corporation |
END CAP RUBBER 8MM CCFL |
0 |
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JKL Components Corporation |
SOCKET T1-1/2 WEDGE BASE |
0 |
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JKL Components Corporation |
LAMP SOCKET 3MM PUSH-IN 20AWG BK |
0 |
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JKL Components Corporation |
LAMP SOCKET .017-020 PIN |
0 |
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JKL Components Corporation |
ASSY OUTPUT 3PIN DUAL BXA12379 |
0 |
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JKL Components Corporation |
ASSEMBLY OUTPUT CONNECTOR |
0 |
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JKL Components Corporation |
LED CONTROLLER |
0 |
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JKL Components Corporation |
ASSEMBLY INPUT CONNECTOR |
0 |
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JKL Components Corporation |
ASSEMBLY INPUT CONNECTOR |
0 |
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JKL Components Corporation |
ASSY OUTPUT FOR BXA-12630-5.5M |
0 |
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JKL Components Corporation |
ASSY INPUT 3PIN FOR BXA12379 |
0 |
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JKL Components Corporation |
LED MOUNT CLIP LIGHT BAR STRIP |
0 |
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JKL Components Corporation |
ASSEMBLY CONN OUTP FOR BXA12617C |
0 |
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JKL Components Corporation |
ASSEMBLY OUTPT-CONN |
0 |
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JKL Components Corporation |
ASSEMBLY CONN OUTP FOR BXA-503 |
0 |
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JKL Components Corporation |
LAMP SOCKET WEDGE FLYING 5MM BK |
0 |
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JKL Components Corporation |
ASSEMBLY CONN OUTP FOR BXA-12549 |
0 |
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JKL Components Corporation |
SOCKET T3-1/4 PUSH IN TYPE |
0 |
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Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste