Accessories

Image Part Number Description / PDF Quantity Rfq
FTA-BL-SFP+/GRN

FTA-BL-SFP+/GRN

Finisar Corporation

ACCY BAIL FOR SFP+ MOD GREEN

0

FTA-BL-SFP+/WHT

FTA-BL-SFP+/WHT

Finisar Corporation

ACCY BAIL FOR SFP+ MOD WHITE

0

FTA-BL-SFP+/GRY

FTA-BL-SFP+/GRY

Finisar Corporation

ACCY BAIL FOR SFP+ MOD GRAY

0

FTA-BL-SFP+/BGE

FTA-BL-SFP+/BGE

Finisar Corporation

ACCY BAIL FOR SFP+ MOD BEIGE

0

FTA-BL-SFP+/YLO

FTA-BL-SFP+/YLO

Finisar Corporation

ACCY BAIL FOR SFP+ MOD YELLOW

0

XA17AAZ5ZZJD

XA17AAZ5ZZJD

Finisar Corporation

XFP-OA PLUGGABLE OPTICAL AMPLIFI

0

XA13AAZ5ZZJD

XA13AAZ5ZZJD

Finisar Corporation

XFP-OA PLUGGABLE OPTICAL AMPLIFI

0

XC00AARTZAJ

XC00AARTZAJ

Finisar Corporation

HOST SYSTEM, CHASSIS, RF-OVER-FI

0

FTA-BL-SFP+/RED

FTA-BL-SFP+/RED

Finisar Corporation

ACCY BAIL FOR SFP+ MOD RED

0

FINF050-100WCLL2

FINF050-100WCLL2

Finisar Corporation

INTERLEAVER 50-100G C-BAND LC/PC

0

FTA-BL-SFP+/ORG

FTA-BL-SFP+/ORG

Finisar Corporation

ACCY BAIL FOR SFP+ MOD ORANGE

0

XC00AAQTZAJ

XC00AAQTZAJ

Finisar Corporation

HOST SYSTEM, 1.2GHZ, XFP-RF TX,

0

T-1850-800S-3210-94

T-1850-800S-3210-94

Finisar Corporation

OPTICAL DIFFRACTION GRATING

0

XPDCAA

XPDCAA

Finisar Corporation

POWER SUPPLY, XFP-RF CHASSIS, DC

0

FTA-BL-SFP+/BRW

FTA-BL-SFP+/BRW

Finisar Corporation

ACCY BAIL FOR SFP+ MOD BROWN

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

RFQ BOM Call Skype Email
Top