| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Excelitas Technologies |
MOUNT 100.20 |
0 |
|
 |
Excelitas Technologies |
PS-1110 POWER SUPPLY |
0 |
|
 |
Excelitas Technologies |
PROTECTIVE GLASS; WL=1064NM; D=1 |
51 |
|
 |
Excelitas Technologies |
FYD-1101 LITE PAC |
2 |
|
 |
Excelitas Technologies |
PROTECTIVE GLASS; WL=532NM; D=11 |
3 |
|
 |
Excelitas Technologies |
FYD-1150 LITE PAC |
21 |
|
 |
Excelitas Technologies |
HOT MIRROR ASMBLY PARABOLIC LAMP |
5 |
|
 |
Excelitas Technologies |
PS-1120 POWER SUPPLY |
0 |
|
 |
Excelitas Technologies |
HOT MIRROR ASMBLY ELLIPTICAL LAM |
0 |
|
|
Excelitas Technologies |
12" HIROSE CABLE |
0 |
|
|
Excelitas Technologies |
KINEFLEX-3-561-0.7-FCP8-P |
0 |
|
|
Excelitas Technologies |
FYD-1150-B TRIGGER MODULE |
0 |
|
|
Excelitas Technologies |
LASER MODULE NANOBENCH ADAPTER |
0 |
|
|
Excelitas Technologies |
POWER CABLE CIPRM MODULES |
0 |
|
|
Excelitas Technologies |
PROTECTIVE GLASS; FUSED SILICA; |
3 |
|
|
Excelitas Technologies |
LASER MOD OPTICAL TABLE MOUNT |
0 |
|
|
Excelitas Technologies |
HOT MIRROR ASMBLY ELLIPTICAL LAM |
0 |
|
|
Excelitas Technologies |
LASER MODULE IFLEX ADAPTER |
0 |
|
|
Excelitas Technologies |
PROTECTIVE GLASS; WL=1064NM; D=1 |
20 |
|
|
Excelitas Technologies |
SHIELDED POWER CABLE |
0 |
|
Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste