Accessories

Image Part Number Description / PDF Quantity Rfq
0359030096

0359030096

Woodhead - Molex

CONN SEAL FOR PT BULB SOCKET

20407

1801600003

1801600003

Woodhead - Molex

LED HOLDER W/LENS SERIES CKT

0

1807200002

1807200002

Woodhead - Molex

LED HOLDER FOR CREE CXA25

893

1804160104

1804160104

Woodhead - Molex

CITIZEN CLL040 HEAT STAKE VERS

2187

0354779002

0354779002

Woodhead - Molex

CONN FEMALE TERM 18-20AWG

0

1805551041

1805551041

Woodhead - Molex

LED HLDR 24X20MM RECT 600

347

0494549004

0494549004

Woodhead - Molex

DUMMY SEAL

1000

1800800000

1800800000

Woodhead - Molex

SOCKET ASSY FOR HELIEON 80MM

51

1805800004

1805800004

Woodhead - Molex

NICHIA LED HOLDER ZHAGA STYLE

0

1801500000

1801500000

Woodhead - Molex

LED ARRAY HOLDER

29

0494549002

0494549002

Woodhead - Molex

S8 WIRE SEAL S

1

0494549003

0494549003

Woodhead - Molex

S8 WIRE SEAL L

0

1805600001

1805600001

Woodhead - Molex

CREE CXA1507 CXA1512 LED HOLDER

0

1804120001

1804120001

Woodhead - Molex

CITIZEN CLL010 HOLDER ASSEMBLY

0

1805800005

1805800005

Woodhead - Molex

NICHIA LED ARRAY HOLDER 3 FINGER

0

0354658000

0354658000

Woodhead - Molex

BULB SOCKET EARTH TERM 18-20AWG

1339

1808100001

1808100001

Woodhead - Molex

LED HOLDER 24X24MM ROUND

0

1041330227

1041330227

Woodhead - Molex

SEALED WEDGE BULB SOCKET 2P

0

1042280210

1042280210

Woodhead - Molex

DIODE RECT 16KV 2A SMD

0

1805551051

1805551051

Woodhead - Molex

LED HLDR 28X28MM RECT 600

397

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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