Accessories

Image Part Number Description / PDF Quantity Rfq
5150006F

5150006F

Dialight

ACCT MOUNT CLIP/RETAINING RING

113

373041001203

373041001203

Dialight

PMI BASE 11/16 INCAND BAY SLDR

10

2701930702

2701930702

Dialight

PMI BASE 15/32 INCAND SOLDER

0

080091405300

080091405300

Dialight

PMI BASE 1 NEON CNDLBR SCREW

0

019041005200

019041005200

Dialight

PMI BASE T-3 1/4 BAYO 1INC SLDR

0

1110112300

1110112300

Dialight

PMI T-1 3/4 INCAND GREEN FROSTED

0

080311409300

080311409300

Dialight

PMI BASE 1 NEON T-4 1/2 CNDLBRA

0

047400129300

047400129300

Dialight

PMI BASE 1INCAND S6 CNDLBR SCRW

0

037041001206

037041001206

Dialight

PMI BASE 9/16INCAN T-3 1/4 SLDR

0

019340605301

019340605301

Dialight

PMI BASE G-6 BAYO 1 INCAND SLDR

0

026041011201

026041011201

Dialight

PMI BASE BAYO 11/16 INCAND SLDR

0

812103009500

812103009500

Dialight

PMI BASE PRESS TO TEST T-1 3/4

0

095040809271

095040809271

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

1901875

1901875

Dialight

IND SWITCH IPS 3/4 SQUARE WHITE

0

2503334500

2503334500

Dialight

DATA CAP FRESNEL 3/8 CYL BLUE

0

169046311310

169046311310

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

080040805340

080040805340

Dialight

PMI BASE 1NEON T-3 1/4 BAY SLDR

0

047350229300

047350229300

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

169576311313

169576311313

Dialight

PMI BASE 11/16 NEON BAY QC

0

095946309360

095946309360

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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