| Image | Part Number | Description / PDF | Quantity | Rfq |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2-HEADER 2LD 4" |
0 |
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Visual Communications Company, LLC |
VERTICAL SINGLE ROW HDR |
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Visual Communications Company, LLC |
RIGHT ANGLE SINGLE ROW HDR |
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Visual Communications Company, LLC |
T-4 D.C BAYONET |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2HEADER 3LD 18" |
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Visual Communications Company, LLC |
VERTICAL DUAL ROW HDR |
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Visual Communications Company, LLC |
LAMPHOLDER SLDR CUP BLACK |
0 |
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Visual Communications Company, LLC |
PMI .290" SOCKET SOLDER TERM AMB |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2HEADER 3LD 6" |
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Visual Communications Company, LLC |
PCL .250" LED SOCKET 24VDC BLACK |
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Visual Communications Company, LLC |
WIRING PLUG FOR USE WITH C40 SER |
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Visual Communications Company, LLC |
LED HDWR MNT CLIP 2PC SILVER |
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Visual Communications Company, LLC |
LAMPHOLDER SLDR LUG HOLE MNT BK |
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Visual Communications Company, LLC |
T 3 1/4 INDICATOR 120V .17A LUG |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2HEADER 2LD 12" |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2HEADER 2LD 6" |
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Visual Communications Company, LLC |
T-3 1 4 BULB SOCKET BAYONET |
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Visual Communications Company, LLC |
PMI ROUND .660" INC/NEON 250V HO |
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Visual Communications Company, LLC |
JUMPER CBL ASSY 2HEADER 2LD 12" |
0 |
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Visual Communications Company, LLC |
PMI ROUND .5" TAB HOLDER |
0 |
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Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste