| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Electronic Assembly (Display Visions) |
TOUCHPANEL FOR EA DOGXL240 |
0 |
|
 |
TE Connectivity AMP Connectors |
80MM BASE, ASSEMBLY, SR MODULE |
74 |
|
 |
Digital View Inc. |
CABLE LVDS PANEL 460MM ROHS |
6 |
|
 |
Visual Communications Company, LLC |
B6 BULB SOCKET BAYONET |
480 |
|
 |
NTE Electronics, Inc. |
5050 RGB+W/WW JUMPER CONN |
40 |
|
 |
NTE Electronics, Inc. |
T CONNECTOR FOR 5050 LED |
700 |
|
 |
Dialight |
PMI CAP STOVEP RED 15/32 TRANSP |
166 |
|
 |
Digital View Inc. |
CABLE LVDS |
0 |
|
 |
Bridgetek |
POE BRIDGE 10/100M BASE-T RJ45 C |
0 |
|
 |
US-Lasers, Inc. |
POWER SUPPLY FOR LASER SMT |
10 |
|
 |
Newhaven Display, Intl. |
PCB ADAPTER 33P FFC-THRU-HOLE |
0 |
|
 |
Matrix Orbital |
VFD FILTER 20X4 RED 96MMX35MM |
0 |
|
 |
Khatod |
ALUMINUM HOLDER FOR ULTRA CLEAR |
0 |
|
 |
NTE Electronics, Inc. |
5050 LED STRIP CONNECTOR |
399 |
|
 |
Visual Communications Company, LLC |
VENTOFLEX, POWER CABLE, POSITIVE |
45 |
|
 |
Phoenix Contact |
FO SPLICE BOX 6ST DUPLEX |
2 |
|
 |
Visual Communications Company, LLC |
S8 BULB SOCKET BAYONET |
0 |
|
 |
Inspired LED |
INDEPENDENCE DIMMER MUTI-ZONE WI |
0 |
|
 |
NTE Electronics, Inc. |
MOUNTING CLIP FOR 3MM LED |
784 |
|
 |
LEDiL |
BASE RND 58.6MM DIA 12.8MM HT WH |
16 |
|
Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste