| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
JKL Components Corporation |
END CAP WITH WIRE EXIT HOLE FOR |
50 |
|
 |
NTE Electronics, Inc. |
5MM LED MOUNTING CLIP |
643 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE ENDURANCE S BASE ASSY 8 |
0 |
|
 |
Woodhead - Molex |
NICHIA LED HOLDER ZHAGA STYLE |
0 |
|
 |
Woodhead - Molex |
LED ARRAY HOLDER |
29 |
|
 |
Phoenix Contact |
FO SPLICE BOX 6ST DUPLEX |
1 |
|
 |
Varitronix International Ltd. |
BACKLIGHT FOR TRANSFL GLASS 2LED |
0 |
|
 |
ESPROS Photonics AG |
EPC-BP955-8.0 X 8.0 X 0.3MM |
0 |
|
 |
NKK Switches |
SW PB RND BLACK SNAP IN SLD MNT |
42 |
|
 |
Digital View Inc. |
CABLE PANEL TTL 330MM |
0 |
|
 |
JKL Components Corporation |
1 METER LED CHANNEL WITH WHITE D |
2 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE DRIVE Z50 DALI 1.05A 24 |
20 |
|
 |
MakersLED |
5 CHANNEL MAKERSLED DRIVER |
20 |
|
 |
Inspired LED |
CLEAR FLEX STRIP MOUNTING CLIPS |
0 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE DRIVE Z50, 0-10V, 1.05A |
17 |
|
 |
Phoenix Contact |
MOUNTING PLATE |
0 |
|
 |
Electronic Assembly (Display Visions) |
LED B/L FOR DOGM128 YLW/GRN |
160 |
|
 |
Digital View Inc. |
PANEL CABLE, 610MM |
0 |
|
 |
LEDiL |
ASSY ROUND 44MM (D) 5,5MM(H) |
8 |
|
 |
Phoenix Contact |
FO SPLICE BOX 12 LC DUPLEX |
3 |
|
Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste