1. Overview

Video Inspection Systems (VIS) are advanced optical measurement and defect detection solutions that combine machine vision technology with precision optics. These systems enable non-contact, high-speed, and high-accuracy inspection of components and materials across various industries. Modern VIS integrates AI-driven image processing algorithms, multi-spectral imaging, and automated analysis to ensure product quality, safety, and compliance with manufacturing standards.

2. Major Types and Functional Classification

3. Structure and Components

Typical VIS configurations include:

• Optical subsystem: 4K CMOS/CCD sensors with variable magnification lenses
• Illumination module: Programmable LED arrays (400-1000nm range)
• Motion control: Precision XYZ stages with sub-micron positioning accuracy
• Processing unit: Embedded GPUs for real-time image analysis
• Software suite: Custom algorithms for defect classification and SPC reporting
• Environmental controls: Temperature-stabilized enclosures for metrology-grade accuracy

4. Key Technical Parameters

5. Application Fields

Key industry applications:

• Semiconductor manufacturing: Wafer defect detection systems
• Automotive: Cylinder bore surface analysis equipment
• Pharmaceuticals: Tablet coating integrity checkers
• Consumer electronics: Display micro-crack inspection machines
• Aerospace: Turbine blade thermal barrier coating assessment

6. Leading Manufacturers and Products

7. Selection Recommendations

Key selection criteria:

• Match resolution requirements with sensor pixel size and optics capability
• Ensure illumination system covers target material spectral characteristics
• Validate environmental compatibility (temperature, vibration, dust)
• Evaluate software features for specific defect classification needs
• Calculate ROI considering inspection speed vs. production line throughput

Case Study: In lithium battery electrode inspection, selection of 1.5 m resolution system reduced defect escape rate from 200 PPM to 8 PPM.

8. Industry Trends

Emerging development directions:

• Integration of deep learning for adaptive defect recognition
• Quantum dot sensors enabling hyperspectral imaging at video rates
• Miniaturization through embedded vision system-on-chip (VSoC) technology
• Cloud-connected systems enabling predictive maintenance and AI training
• Multi-modal fusion systems combining optical, thermal, and acoustic data

Market projections indicate 12.3% CAGR through 2028, driven by EV battery and advanced packaging inspection demands.