Accessories

Image Part Number Description / PDF Quantity Rfq
VSA2-1M-W

VSA2-1M-W

FLIR

WIRELESS 2 WAY 6MM ART CAM W 1M

0

VSC58-30M

VSC58-30M

FLIR

5.8MM CAM W 30M FIBERGLASS PROBE

0

VSC58-2RM

VSC58-2RM

FLIR

5.8MM CAM W 2M SEMI-RIGID PROBE

0

VSC58-1RM

VSC58-1RM

FLIR

5.8MM CAM W 1M SEMI-RIGID PROBE

0

VSC39-A

VSC39-A

FLIR

CAMERA TIP KITS FOR 3.9MM CAMS

0

VSA2-2

VSA2-2

FLIR

2 WAY 6MM ART CAM W 2M PROBE, LO

0

VSC58-1R

VSC58-1R

FLIR

5.8MM CAM W 1M SEMI-RIGID PROBE

0

VSA2-1M

VSA2-1M

FLIR

2 WAY 6MM ART CAM W 1M PROBE, SH

0

VS-NS

VS-NS

FLIR

VIDEOSCOPE MAIN UNIT NECK STRAP

0

VSA2-2M-W

VSA2-2M-W

FLIR

WIRELESS 2 WAY 6MM ART CAM W 1M

0

VSC80-1R

VSC80-1R

FLIR

8MM CAM W 1M SEMI-RIGID PROBE -

0

VSA4-1M-W

VSA4-1M-W

FLIR

WIRELESS 4 WAY 8MM ART CAM W 1M

0

VSA2-1-W

VSA2-1-W

FLIR

WIRELESS 2 WAY 6MM ART CAM W 1M

0

VSA2-2-W

VSA2-2-W

FLIR

WIRELESS 2 WAY 6MM ART CAM W 2M

0

VSC58-20M

VSC58-20M

FLIR

5.8MM CAM W 20M FIBERGLASS PROBE

0

VSC39-1FM

VSC39-1FM

FLIR

3.9MM CAM W 1M FLEX PROBE - SHOR

0

VSC58-A

VSC58-A

FLIR

CAMERA TIP KITS FOR 5.8MM CAMS

0

VSC65-12S

VSC65-12S

FLIR

6.5MM 12IN STAINLESS STEEL RIGID

0

VS-C-12V

VS-C-12V

FLIR

12V AUTO CHARGER

0

VSA-AP

VSA-AP

FLIR

VIDEOSCOPE ACCESSORY KIT WITH AC

0

Accessories

1. Overview

Optical inspection equipment accessories are modular components that enhance the functionality, precision, and adaptability of optical inspection systems. These accessories include illumination sources, lenses, sensors, filters, and software modules. They play a critical role in industrial quality control, semiconductor manufacturing, biomedical imaging, and precision measurement by enabling accurate defect detection, dimensional analysis, and material characterization.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Intensity LED LightingUniform illumination, adjustable wavelength, low thermal emissionSurface defect detection in PCB manufacturing
Telecentric LensesMinimize perspective errors, maintain constant magnificationPrecision metrology in semiconductor wafer inspection
Hyperspectral Imaging SensorsCapture spectral and spatial data simultaneouslyMaterial analysis in food quality control
Optical FiltersSelective wavelength transmission/reflectionFluorescence imaging in biomedical diagnostics
Motorized XY StagesHigh-precision positioning with sub-micron resolutionAutomated sample scanning in R&D laboratories

3. Structural and Technical Composition

A typical accessory system consists of:
- Mechanical housing with vibration-damping mounts
- Optical components (lenses, prisms, diffraction gratings)
- Electronic control units with interface ports (USB 3.0, GigE Vision)
- Calibration modules for environmental compensation
- Software development kits (SDKs) for system integration

4. Key Technical Specifications

ParameterDescriptionImportance
ResolutionMinimum detectable feature size (1-10 m range)Determines defect detection capability
Wavelength RangeOperational spectral band (UV-VIS-NIR: 200-2500 nm)Material interaction specificity
Working DistanceOptimal object-to-lens distance (10-200 mm)System design flexibility
Data Transfer RateUp to 10 Gbps via CoaXPress interfacesReal-time inspection throughput
Environmental ToleranceOperating temperature (0-50 C), humidity resistanceSystem reliability in industrial settings

5. Application Fields

  • Semiconductor manufacturing (wafer defect inspection)
  • Electronics assembly (AOI systems for solder joint analysis)
  • Medical diagnostics (digital pathology scanners)
  • Automotive industry (surface finish measurement)
  • Pharmaceutical packaging (print quality verification)

6. Leading Manufacturers and Representative Products

ManufacturerProduct SeriesKey Specifications
KeyenceCV-X4 Series ControllersMulti-sensor fusion, 0.1 m resolution
CognexDVT Summit SeriesEmbedded vision systems with AI algorithms
OlympusStream Essentials Software3D surface analysis for metallurgy
CCS OptoLDR2-50SW2 LightingStrobe synchronization at 50,000 lx output

7. Selection Recommendations

Key considerations include:
- Matching numerical aperture (NA) with required depth of field
- Spectral compatibility between light sources and sensors
- Environmental sealing (IP ratings for dusty/humid environments)
- Software API compatibility with existing automation systems
- Calibration certification (NIST traceability preferred)

8. Industry Trends Analysis

Current development trends include:
- Integration of AI-powered defect classification algorithms
- Miniaturization through MEMS-based optical components
- Multi-spectral imaging combining visible and thermal IR bands
- Standardization of plug-and-play interfaces (USB4 Vision, XCP)

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