Accessories

Part Number	Description / PDF	Quantity
FTM120 Excelitas Technologies	FIXED TUBE MINI, 120	6
PNTX-C30405 Omron Automation & Safety Services	PENTAX LENS	0
35-30-01-000 Excelitas Technologies	KIT, CONVERSION, CURVED COVER	1
VSA2-1M FLIR	2 WAY 6MM ART CAM W 1M PROBE, SH	0
45-08-14-000 Excelitas Technologies	2.0X 400FL MINI CAMERA TUBE, SWI	5
FTM160 Excelitas Technologies	FIXED TUBE MINI, 160	2
FT200 Excelitas Technologies	FIXED TUBE, 200	2
VS-NS FLIR	VIDEOSCOPE MAIN UNIT NECK STRAP	0
29-90-82-000 Excelitas Technologies	0.38X TV TUBE	1
45-31-60-000 Excelitas Technologies	7:1 ZOOM STEPPER MOTORIZED, SWIR	5
VPI-BH Tronex (Menda/EasyBraid/Tronex)	VPI BOARD HOLDER	0
810-10030X Excelitas Technologies	X-Cite Mini+ flange	2
FC50 Excelitas Technologies	FOCUS & COAX MODULE W/ 50MM WD	0
33-03-00-000 Excelitas Technologies	M25 X 0.75 SPACER KIT	0
WAL-309-355-020 Omron Automation & Safety Services	RMTE BALLAST FOR WAL138453000	0
26505-MX5-PWS Aven	POWER SUPPLY FOR 505 MX5 SERIES	221
810-10031X Excelitas Technologies	X-Cite Mini+ flange	2
26700-412 Aven	SWIVEL BALL JOINT 1/4"-20 WITH M	22
30-13-37-000 Excelitas Technologies	15MM FINE FOCUS WITH STEPPER	0
296591-310 Excelitas Technologies	VERTICAL ILLUM & FOCUS MODULE	5

Accessories

1. Overview

Optical inspection equipment accessories are modular components that enhance the functionality, precision, and adaptability of optical inspection systems. These accessories include illumination sources, lenses, sensors, filters, and software modules. They play a critical role in industrial quality control, semiconductor manufacturing, biomedical imaging, and precision measurement by enabling accurate defect detection, dimensional analysis, and material characterization.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Intensity LED Lighting	Uniform illumination, adjustable wavelength, low thermal emission	Surface defect detection in PCB manufacturing
Telecentric Lenses	Minimize perspective errors, maintain constant magnification	Precision metrology in semiconductor wafer inspection
Hyperspectral Imaging Sensors	Capture spectral and spatial data simultaneously	Material analysis in food quality control
Optical Filters	Selective wavelength transmission/reflection	Fluorescence imaging in biomedical diagnostics
Motorized XY Stages	High-precision positioning with sub-micron resolution	Automated sample scanning in R&D laboratories

3. Structural and Technical Composition

A typical accessory system consists of:
- Mechanical housing with vibration-damping mounts
- Optical components (lenses, prisms, diffraction gratings)
- Electronic control units with interface ports (USB 3.0, GigE Vision)
- Calibration modules for environmental compensation
- Software development kits (SDKs) for system integration

4. Key Technical Specifications

Parameter	Description	Importance
Resolution	Minimum detectable feature size (1-10 m range)	Determines defect detection capability
Wavelength Range	Operational spectral band (UV-VIS-NIR: 200-2500 nm)	Material interaction specificity
Working Distance	Optimal object-to-lens distance (10-200 mm)	System design flexibility
Data Transfer Rate	Up to 10 Gbps via CoaXPress interfaces	Real-time inspection throughput
Environmental Tolerance	Operating temperature (0-50 C), humidity resistance	System reliability in industrial settings

5. Application Fields

Semiconductor manufacturing (wafer defect inspection)
Electronics assembly (AOI systems for solder joint analysis)
Medical diagnostics (digital pathology scanners)
Automotive industry (surface finish measurement)
Pharmaceutical packaging (print quality verification)

6. Leading Manufacturers and Representative Products

Manufacturer	Product Series	Key Specifications
Keyence	CV-X4 Series Controllers	Multi-sensor fusion, 0.1 m resolution
Cognex	DVT Summit Series	Embedded vision systems with AI algorithms
Olympus	Stream Essentials Software	3D surface analysis for metallurgy
CCS Opto	LDR2-50SW2 Lighting	Strobe synchronization at 50,000 lx output

7. Selection Recommendations

Key considerations include:
- Matching numerical aperture (NA) with required depth of field
- Spectral compatibility between light sources and sensors
- Environmental sealing (IP ratings for dusty/humid environments)
- Software API compatibility with existing automation systems
- Calibration certification (NIST traceability preferred)

8. Industry Trends Analysis

Current development trends include:
- Integration of AI-powered defect classification algorithms
- Miniaturization through MEMS-based optical components
- Multi-spectral imaging combining visible and thermal IR bands
- Standardization of plug-and-play interfaces (USB4 Vision, XCP)