Motor Driver Boards, Modules

Image Part Number Description / PDF Quantity Rfq
105090003

105090003

Seeed

MAKER DRIVE - MIX1508 H-BRIDGE M

11

105090004

105090004

Seeed

MAKER MDD3A - DUAL CHANNEL 3A DC

91

105990007

105990007

Seeed

STEPPER DRIVER 2A 7V LOAD

13

105030027

105030027

Seeed

BLDC MOTOR SHIELD TB6605

92

108990062

108990062

Seeed

ROBOMASTER C620 BRUSHLESS DC MOT

0

105010000

105010000

Seeed

BRUSHED DRIVER 15A 20V LOAD

0

Motor Driver Boards, Modules

1. Overview

Motor driver boards/modules are electronic devices that act as intermediaries between control systems (e.g., microcontrollers) and motors. They convert low-power control signals into high-power electrical currents to drive motors efficiently. These components enable precise regulation of motor speed, direction, torque, and position. Their importance spans across automation, robotics, industrial machinery, and consumer electronics, where accurate motion control is critical for system performance.

2. Main Types & Functional Classification

Type Functional Features Application Examples
H-Bridge Drivers Bi-directional control using transistor bridges, basic speed regulation DC motor direction control in robotic arms
Stepper Motor Drivers Microstepping, position accuracy, torque control 3D printers, CNC machines
Servo Controllers Feedback loop integration, precise angular positioning RC vehicles, industrial automation
Brushless DC (BLDC) Drivers Electronic commutation, high efficiency, variable speed Drones, HVAC systems
Integrated Smart Modules Embedded control logic, thermal protection, communication interfaces Autonomous vehicles, medical pumps

3. Structure & Components

A typical motor driver contains:

  • Power Transistors: MOSFETs or IGBTs for switching high currents
  • Control IC: Processes PWM signals and manages commutation
  • Heat Sink: Aluminum-based PCB or external fins for thermal management
  • Protection Circuits: Overcurrent, overtemperature, and voltage spike suppression
  • Connectors: Screw terminals for motor wiring and control interfaces (UART/SPI)

4. Key Technical Specifications

Parameter Importance
Max Continuous Current Determines motor power capacity (e.g., 5A for NEMA 23 stepper)
Voltage Range Must match motor supply (e.g., 8-45V for industrial BLDC drivers)
Efficiency (Typical >90%) Impacts thermal performance and energy consumption
Control Resolution Microstepping levels (e.g., 1/16-step for precision engravers)
Protection Features Overcurrent/voltage, thermal shutdown (critical for reliability)
Communication Protocols CAN, Modbus support for industrial IoT integration

5. Application Fields

  • Industrial: CNC machining centers, conveyor belt systems
  • Consumer: Smart home appliances, gaming consoles
  • Medical: MRI scanner positioning, insulin pumps
  • Automotive: Electric vehicle powertrains, EPS systems
  • Robotics: Collaborative robot joint control

6. Leading Manufacturers & Products

Manufacturer Representative Product Key Specifications
TI (Texas Instruments) DRV8825 2.5A RMS, 1/32 microstepping, thermal shutdown
STMicroelectronics L6470 3.0A peak, SPI interface, stall detection
ON Semiconductor MC33926 3.0A continuous, bidirectional control
Maxon Motor EPOS4 Compact 50A peak, EtherCAT interface, encoder feedback

7. Selection Guidelines

  1. Match driver current/voltage ratings to motor specifications
  2. Select control mode (PWM, analog, digital) based on system requirements
  3. Consider environmental factors (temperature, vibration)
  4. Verify required protection features (IP rating for harsh environments)
  5. Evaluate integration needs (footprint, communication protocols)
  6. Balance cost vs. performance for volume production

8. Industry Trends

Emerging trends include:

  • Integration: System-on-Chip (SoC) drivers combining control and power stages
  • Smart Diagnostics: Built-in current sensing and predictive maintenance algorithms
  • Wide Bandgap Semiconductors: SiC/GaN transistors enabling higher switching frequencies
  • Wireless Control: Bluetooth/Wi-Fi-enabled drivers for IoT applications
  • Miniaturization: Chip-scale packaging for space-constrained applications

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