Specialized

Image Part Number Description / PDF Quantity Rfq
DS1996L-F5+

DS1996L-F5+

Maxim Integrated

IBUTTON MEMORY 64KBit F5

817

DS1977-F5#

DS1977-F5#

Maxim Integrated

IBUTTON EEPROM 32KBit F5

0

DS1973-F5+

DS1973-F5+

Maxim Integrated

IBUTTON EEPROM 4KBit F5

201

DS1990A-F3+

DS1990A-F3+

Maxim Integrated

IC IBUTTON SERIAL NUMBER F3

303

DS1990R-F5#

DS1990R-F5#

Maxim Integrated

IBUTTON SERIAL NUMBER F5

1268

DS1993L-F5+

DS1993L-F5+

Maxim Integrated

IBUTTON MEMORY 4KBit F5

787

DS1920-F5+

DS1920-F5+

Maxim Integrated

IBUTTON TEMPERATURE F5

1047000

DS1922L-F5#

DS1922L-F5#

Maxim Integrated

IBUTTON TEMP LOGGER

17

DS9092R+

DS9092R+

Maxim Integrated

IBTN PORT

356

DS1922E-F5#

DS1922E-F5#

Maxim Integrated

IBUTTON TEMP LOGGER 4KBit F5

210

DS1972-F3+

DS1972-F3+

Maxim Integrated

IBUTTON EEPROM 1KBit F3

11100

DS1995L-F5+

DS1995L-F5+

Maxim Integrated

IBUTTON MEMORY 16KBit F5

0

DS1963S-F5+

DS1963S-F5+

Maxim Integrated

IBUTTON MONETARY SHA-1

4218

DS9092K#

DS9092K#

Maxim Integrated

KIT IBUTTON STARTER

818

DS1982-F3+

DS1982-F3+

Maxim Integrated

IBUTTON 1KBit ADD-ONLY F3

30

DS1923-F5#

DS1923-F5#

Maxim Integrated

IBUTTON TEMP/HUMIDITY LOGGER F5

549

DS1922T-F5#

DS1922T-F5#

Maxim Integrated

IBUTTON TEMP LOGGER

256

DS1921G-F5#

DS1921G-F5#

Maxim Integrated

IBUTTON THERMOCHRON F5

0

DS1990A-F5+

DS1990A-F5+

Maxim Integrated

IBUTTON SERIAL NUMBER F5

438

DS1961S-F3+

DS1961S-F3+

Maxim Integrated

IBUTTON EEPROM 1KBit F3

18

Specialized

1. Overview

Specialized memory cards and modules refer to high-reliability storage solutions designed for demanding environments. These products feature enhanced durability, extended temperature ranges, and advanced error-correction technologies. They play critical roles in industrial automation, medical devices, aerospace systems, and automotive applications where standard consumer-grade storage would fail.

2. Main Types & Functional Classification

TypeKey FeaturesApplication Examples
Industrial SSD ModulesWide temperature tolerance (-40 C to 85 C), ECC support, power-loss protectionFactory automation controllers
Automotive Grade MemoryVibration resistance, AEC-Q100 certification, extended lifecycleADAS systems, infotainment units
Military-Grade StorageConformal coating, shock resistance, secure erase capabilitiesRadar systems, unmanned vehicles
Medical Imaging CardsHigh sustained write speeds, DICOM compliance, radiation resistanceMRI scanners, ultrasound equipment

3. Structure & Composition

Typical components include:

  • High-density NAND flash die with wear-leveling controllers
  • Thermal-resistant PCB with gold-plated contact pads
  • Advanced ECC engines (LDPC, BCH)
  • Secure authentication modules (optional)
  • Industrial-grade packaging materials (ceramic or reinforced plastic)

4. Key Technical Specifications

ParameterImportance
Operating TemperatureDetermines environmental tolerance (-55 C to 125 C critical for aerospace)
Endurance (P/E Cycles)Specifies program/erase cycle resistance (up to 100,000 cycles)
Data RetentionRetention period under power-off conditions (minimum 10 years)
Interface SpeedTransfer rates (up to 3120MB/s for PCIe 4.0 modules)
MTBFMean Time Between Failures (exceeding 2 million hours)

5. Application Fields

Key industries include:

  • Industrial: CNC machines, robotics controllers
  • Medical: CT scanners, PACS workstations
  • Transportation: Railway signaling systems, avionics
  • Energy: Smart grid controllers, oil exploration equipment

6. Leading Manufacturers & Products

VendorFlagship Product
SanDisk IndustrialiXpand Industrial SDXC
Kingston TechnologyKingston SSDNow UV500 Industrial
Micron TechnologyMicron Automotive LPDDR5
Samsung ElectronicsSamsung PRO Endurance microSD

7. Selection Guidelines

Consider:

  • Environmental operating conditions (temperature, vibration)
  • Required data retention period
  • Interface compatibility (NVMe/SATA/Parallel)
  • Security requirements (encryption, access control)
  • Total cost of ownership (TCO) over device lifecycle

8. Industry Trends

Emerging developments include:

  • Adoption of 3D NAND stacks beyond 200 layers
  • PCIe 5.0 interface integration
  • AI-enabled predictive failure analysis
  • Increased demand for -55 C to 125 C operating ranges
  • Growing implementation of hardware-based security features
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