| Image | Part Number | Description / PDF | Quantity | Rfq |
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iFixit |
PC4-21300 32 GB RAM CHIP |
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iFixit |
PC4-19200 4 GB RAM CHIP / NEW |
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iFixit |
PC2-5300 4 GB RAM CHIP / NEW |
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iFixit |
PC3L-12800 8 GB RAM CHIP / NEW |
0 |
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iFixit |
PC2-6400 4 GB RAM CHIP / NEW |
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iFixit |
PC4-21300 16 GB RAM CHIP |
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iFixit |
PC4-17000 16 GB RAM CHIP |
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iFixit |
PC3L-12800 4 GB RAM CHIP / NEW |
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iFixit |
PC2-6400 2 GB RAM CHIP / NEW |
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iFixit |
PC4-19200 8 GB RAM CHIP / NEW |
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iFixit |
PC4-21300 16 GB ECC REGISTERED R |
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iFixit |
PC3L-12800 2 GB RAM CHIP / NEW |
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iFixit |
PC4-17000 8 GB RAM CHIP |
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iFixit |
PC2-6400 1 GB RAM CHIP / NEW |
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iFixit |
PC2-5300 1 GB RAM CHIP / NEW |
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iFixit |
PC2-5300 2 GB RAM CHIP / NEW |
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iFixit |
PC3-14900 16 GB RAM CHIP |
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iFixit |
PC3-8500 8 GB RAM CHIP |
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iFixit |
PC3-8500 1 GB RAM CHIP |
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iFixit |
PC3-10600 8 GB RAM CHIP / NEW |
0 |
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Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.
| Type | Functional Features | Application Examples |
|---|---|---|
| SD/microSD Cards | Portable flash memory with varying speed classes (UHS-I/II, V30/V60) | Smartphones, drones, action cameras |
| CFexpress Cards | High-speed PCIe/NVMe interface, superior durability | Professional DSLR cameras, video production |
| DRAM Modules | Volatile memory with fast access rates (DDR4/DDR5 SDRAM) | Computers, servers, gaming consoles |
| NAND Flash Modules | Non-volatile storage with MLC/TLC configurations | SSDs, industrial controllers |
| MRAM Modules | Non-volatile, low-power magnetic storage technology | Aerospace, IoT edge devices |
Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.
| Parameter | Description | Importance |
|---|---|---|
| Storage Capacity | 1GB-1TB for cards, 1GB-256GB per module | Determines data volume handling capability |
| Read/Write Speed | 10-1000+ MB/s sequential, 10k-1M IOPS random | Affects system responsiveness |
| Endurance | 1000-100,000 P/E cycles | Dictates product lifespan |
| Operating Temperature | -25 C to +85 C industrial grade | Ensures reliability in harsh environments |
| Interface Protocol | SD UHS-II, NVMe 1.4, DDR5 | Defines compatibility and bandwidth |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Samsung | 980 Pro NVMe SSD | 7000 MB/s read, PCIe 4.0, TBW: 1200 |
| Kingston | FURY DDR5 RGB DIMM | 4800-6000 MT/s, XMP 3.0 support |
| SanDisk | Extreme Pro CFexpress 2.0 | 1700 MB/s, 10,000 write cycles |
| SK hynix | CRONI-DX DDR4 | 32GB RDIMM, 2666MHz, ECC |
| Western Digital | WD_BLACK SN850X | Gen4 controller, 7300 MB/s, HMB feature |
Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.
Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)