Memory - Modules

Part Number	Description / PDF	Quantity
78.C2GCQ.4000C Apacer	8GB DDR3 1600 ECC SO-DIMM 512X8	5
78.A1GDE.40F0C Apacer	DDR3 1333 2GB VLP UDIMM	0
75.A83CV.G020C Apacer	DDR3-1333 2GB ECC SODIMM	0
78.A1GDJ.4000C Apacer	DDR3 1066 2GB UDIMM	0
78.B1GDE.4010C Apacer	4GB DDR3 1333 U-DIMM 256X8 2 RAN	5
75.B83E8.G020C Apacer	DDR3 4GB 1.35V ECC SODIMM	0
78.B1GM3.4050B Apacer	DDR4 2133 4GB UDIMM	0
75.C93E4.G020B Apacer	DDR3-1600 IND 8GB SO-DIMM	0
78.B2GC8.AF1 Apacer	4GB DDR3 1066 SO-DIMM 256X8 2 RA	0
75.A83CF.G020C Apacer	2GB DDR3-1066 INDUS. SO-DIMM 256	0
75.A73CG.G010C Apacer	2GB DDR3-1333 INDUS. SO-DIMM 128	0
75.B93E2.G000C Apacer	4GB DDR3-1600 INDUS. 1.35V SO-DI	0
75.B93E4.G010C Apacer	4GB DDR3-1600 INDUS. SO-DIMM 512	0
75.073CR.G000C Apacer	1GB DDR3-1333 INDUS. UNB DIMM 12	0
75.A83CR.G040C Apacer	MEM DRAM DDR3 DIMM 2GB IND	0
75.C93E2.G000C Apacer	8GB DDR3-1600 INDUS. 1.35V SO-DI	0
78.B2GCJ.AF10C Apacer	4GB DDR3 1600 SO-DIMM 256X8 2 RA	0
75.A73CV.G000C Apacer	2GB DDR3-1333 INDUS. ECC SO-DIMM	0
78.B1GDE.AFF0C Apacer	4GB DDR3 1333 VLP U-DIMM 256X8 2	0
78.B2GF0.AF00B Apacer	4GB DDR4 SDRAM SO-DIMM	0

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)