Memory - Modules

Part Number	Description / PDF	Quantity
SP016GISFE266BH0 Silicon Power	DDR4 ECCSODIMM 2666C19 1GX8 16GB	10
SP032GILFE266FS0 Silicon Power	DDR4 ECCUDIMM 2666C19 2GX8 32GB	10
SP032GISFU266FS0 Silicon Power	DDR4 SODIMM 2666C19 2GX8 32GB	10
SP002GILLU160WH0 Silicon Power	DDR3 UDIMM 1600C11 256MX16 2GB	10
SP004GISFU240NH0 Silicon Power	DDR4 SODIMM 2400C17 512MX8 4GB	10
SP008GISFE266BH0 Silicon Power	DDR4 ECCSODIMM 2666C19 1GX8 8GB	10
SP004GIRFE240NH0 Silicon Power	DDR4 RDIMM 2400C17 512MX8 4GB	10
SP004GILFU240NH0 Silicon Power	DDR4 UDIMM 2400C17 512MX8 4GB	10
SP008GIVLU160NH0 Silicon Power	DDR3 UDIMM-VLP 1600C11 512MX8 8G	10
SP008GISFU266BH0 Silicon Power	DDR4 SODIMM 2666C19 1GX8 8GB	6
SP004GILFE240NH0 Silicon Power	DDR4 ECCUDIMM 2400C17 512MX8 4GB	10
SP008GIRFE266BH0 Silicon Power	DDR4 RDIMM 2666C19 1GX8 8GB	10
SP008GISLU160NH0 Silicon Power	DDR3 SODIMM 1600C11 512MX8 8GB	10
SP032GILFU266FS0 Silicon Power	DDR4 UDIMM 2666C19 2GX8 32GB	10
SP016GIRFE266BH0 Silicon Power	DDR4 RDIMM 2666C19 1GX8 16GB	10
SP032GITFE266FS0 Silicon Power	DDR4 RDIMM-VLP 2666C19 2GX8 32GB	10
SP004GISLU160VH0 Silicon Power	DDR3 SODIMM 1600C11 256MX8 4GB	10
SP032GISFE266FS0 Silicon Power	DDR4 ECCSODIMM 2666C19 2GX8 32GB	10
SP008GILFE266BH0 Silicon Power	DDR4 ECCUDIMM 2666C19 1GX8 8GB	10
SP016GILFU266BH0 Silicon Power	DDR4 UDIMM 2666C19 1GX8 16GB	10

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)