Memory - Modules

Part Number	Description / PDF	Quantity
VR7PU566498GBFMKT Viking Technology	MODULE DDR3L SDRAM 2GB 204SODIMM	5
SFUI2048J3BP2TO-C-MS-221-STD Swissbit	MODULE FLASH NAND SLC 2GB	0
AL24P72L8BLK0M ATP Electronics, Inc.	MODULE DDR3L SDRAM 8GB 240RDIMM	3
WD3SE02GX809-1333L-PD Wintec Industries	MODULE DDR3 SDRAM 2GB 204SOUDIMM	0
M432TNJGR-RA000-D	32GB SLC USB EMBEDDED 3.1 MODULE	0
78.01GC6.4000C Apacer	1GB DDR3 1333 U-DIMM 128X8 1 RAN	5
MT8KTF51264AZ-1G9P1 Micron Technology	MODULE DDR3L SDRAM 4GB 240UDIMM	70
HYS72T128000HR-3S-B	MODULE DDR2 SDRAM 1GB 240DIMM	14
VR7PU1G6498HBFMPT Viking Technology	MODULE DDR3L SDRAM 8GB 204SODIMM	25
SFUI2048J3BP2TO-I-MS-221-STD Swissbit	MODULE FLASH NAND SLC 2GB	0
SFUI1024J3BP2TO-C-MS-221-STD Swissbit	MODULE FLASH NAND SLC 1GB	0
DS1217A-128K-25 Analog Devices, Inc.	MEMORY CIRCUIT, 16KX8, CMOS	18
A4F04QD8BLPBSE ATP Electronics, Inc.	MODULE DDR4 SDRAM 4GB 260SODIMM	1
78.A2GC8.AF00C Apacer	MEMORY MODULE 2GB DDRS SDRAM	0
SP032GISFU266FS0 Silicon Power	DDR4 SODIMM 2666C19 2GX8 32GB	10
A4G08QA8BNPBSE ATP Electronics, Inc.	MODULE DDR4 SDRAM 8GB 260SODIMM	23
SP002GILLU160WH0 Silicon Power	DDR3 UDIMM 1600C11 256MX16 2GB	10
AW12M64B8BLK0MW ATP Electronics, Inc.	MODULE DDR3 SDRAM 4GB 204SODIMM	179
78.D2GF2.4010B Apacer	16GB DDR4 SDRAM SO-DIMM	14
SQR-SD3N2G1K6SEFFB Advantech	MODULE DDR3L SDRAM 2GB 204SODIMM	0

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)