Memory Cards

Image Part Number Description / PDF Quantity Rfq
FDMM032G-CA0

FDMM032G-CA0

Flexxon

MICROSD 32GB

25

FDMS008GBC-3100

FDMS008GBC-3100

Flexxon

FXADV SD 8GB 3D TLC (-25C-85C)

5

FDMS008GSE-1001

FDMS008GSE-1001

Flexxon

FXPRO I SD 8GB SLC DIAMOND GRADE

0

FDMS128GBC-3100

FDMS128GBC-3100

Flexxon

FXADV SD 128GB 3D TLC (-25C-85C)

0

FDMM128GBC-3100

FDMM128GBC-3100

Flexxon

FXADV MICROSD 128GB 3D TLC (-25C

0

FDMM008GPG-1001

FDMM008GPG-1001

Flexxon

FXPRO I MICROSD 8GB PSLC GOLD GR

10

FDMS001GSE-1004

FDMS001GSE-1004

Flexxon

FXPRO I (HIGHIOPS) SD 1GB SLC DI

0

FDMM004GCG-3101

FDMM004GCG-3101

Flexxon

FXADV MICROSD 4GB 3D PSLC GOLD G

5

FDMS008G-CA0

FDMS008G-CA0

Flexxon

SD 8GB

1

FPCF002GSS-C100

FPCF002GSS-C100

Flexxon

LEGACY II CF CARD 2GB SLC SILVER

0

FDMM001GSE-N300

FDMM001GSE-N300

Flexxon

FXPREM III MICROSD 1GB SLC DIAMO

0

FDMM064GBE-3101

FDMM064GBE-3101

Flexxon

FXADV MICROSD 64GB 3D TLC DIAMON

5

FDMM032GME-1004

FDMM032GME-1004

Flexxon

FXPRO I (HIGHIOPS) MICROSD 32GB

10

FDMS064GBC-3100

FDMS064GBC-3100

Flexxon

FXADV SD 64GB 3D TLC (-25C-85C)

5

FDMM008G-CA0

FDMM008G-CA0

Flexxon

MICROSD 8GB

12

FDMM004GMG-1004

FDMM004GMG-1004

Flexxon

FXPRO I (HIGHIOPS) MICROSD 4GB M

10

FDMS008GMC-1000

FDMS008GMC-1000

Flexxon

FXPRO I SD 8GB MLC (-25C-85C)

10

FDMM512MSG-1001

FDMM512MSG-1001

Flexxon

FXPRO I MICROSD 512MB SLC GOLD G

20

FDMM016GBE-3101

FDMM016GBE-3101

Flexxon

FXADV MICROSD 16GB 3D TLC DIAMON

5

FDMM128G-CA0

FDMM128G-CA0

Flexxon

MICROSD 128GB

5

Memory Cards

1. Overview

Memory Cards are removable storage devices used for data storage and transfer in electronic devices. They utilize flash memory technology to retain data without power supply. These compact modules play a critical role in consumer electronics, industrial equipment, and enterprise systems by enabling portable storage solutions with varying capacities and speeds.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
SD Card (Secure Digital)Standardized form factor, supports FAT32/exFAT file systemsDigital cameras, laptops
microSDSmallest physical size with adapter compatibilitySmartphones, drones
CFast/C CompactFlashHigh-speed interfaces (SATA/PCIe), industrial-grade durabilityProfessional DSLR cameras
NVMe SSD ModulesPCIe interface with advanced parallelismHigh-performance computing

3. Structure and Components

Typical memory card consists of: - NAND flash memory chips (storage medium) - Controller IC (manages data operations) - Physical interface (e.g., UHS-II, PCIe) - Protective casing with contact pads - Error correction and wear-leveling circuitry

4. Key Technical Specifications

ParameterDescriptionImportance
Storage Capacity128MB-1TB rangeDetermines data volume capability
Read/Write Speed10-3500MB/s rangeAffects data transfer efficiency
Interface TypeSD UHS-II, PCIe 4.0Dictates compatibility and speed ceiling
Endurance Rating1,000-100,000 P/E cyclesMeasures lifespan for write-intensive applications
Operating Temperature-25 C to +85 CDefines environmental reliability

5. Application Fields

Primary industries include: - Consumer Electronics (smartphones, tablets) - Industrial Automation (PLC systems, data loggers) - Medical Devices (portable diagnostics equipment) - Automotive (dash cams, autonomous driving systems) - Aerospace (flight data recorders)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
SanDiskExtreme Pro microSDXC1TB, 160MB/s read, A2 rating
SamsungEVO Plus SD Card256GB, UHS-I, 130MB/s
KioxiaCFast 2.0 Card64GB, 550MB/s, industrial temp range
Western DigitalUltrastar SN530 NVMe3.2TB, PCIe 4.0, 750,000 IOPS

7. Selection Recommendations

Key considerations: - Match interface compatibility with host device - Prioritize speed class for specific workloads (e.g., 4K video recording) - Evaluate environmental requirements (temperature, shock resistance) - Consider total cost of ownership vs. endurance rating - Verify file system support for capacity requirements

8. Industry Trends

Emerging trends include: - Adoption of PCIe 5.0 interfaces for 10,000MB/s+ speeds - 3D NAND stacking for terabit-level capacities - AI-optimized storage with on-card processing - Increased demand for automotive-grade memory modules - Standardization of CXL interface for low-latency applications

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