| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
512MB SLC MICROSD CARD I-TEMP (- |
0 |
|
|
 |
Flexxon |
WORM SD 4GB MLC GOLD GRADE |
0 |
|
 |
Phoenix Contact |
MEMORY CARD SD |
1 |
|
 |
TDK Corporation |
MEMORY CARD COMPACTFLASH 1GB SLC |
0 |
|
 |
TDK Corporation |
MEM CARD MICROSD 512MB UHS SLC |
0 |
|
 |
Panasonic |
MEMORY CARD SDHC 32GB UHS |
185 |
|
 |
Swissbit |
MEMORY CARD SD 512MB CLASS 6 SLC |
87 |
|
 |
Swissbit |
MEMORY CARD COMPACTFLASH 4GB SLC |
0 |
|
 |
TDK Corporation |
MEMORY CARD MICROSD 1GB UHS SLC |
129 |
|
 |
ATP Electronics, Inc. |
MEM CARD MICROSD 4GB CLS 10 AMLC |
380 |
|
 |
TDK Corporation |
MEMORY CARD CFAST 8GB SLC |
0 |
|
 |
Swissbit |
MEM CARD MICROSD 512MB UHS SLC |
1 |
|
 |
ATP Electronics, Inc. |
ATP MICROSDXC I-TEMP. 128GB TLC |
39 |
|
 |
Virtium |
MEMORY CARD CFAST 120GB MLC |
0 |
|
 |
Swissbit |
MEMORY CARD SD 1GB UHS SLC |
0 |
|
 |
ATP Electronics, Inc. |
S600SI_MICROSD3.0 CG 16GB |
25 |
|
 |
64GB 3D MICROSD CARD I-TEMP (-40 |
0 |
|
|
 |
Apacer |
MEM CARD SDHC 16GB CLASS 10 SLC |
1 |
|
 |
Apacer |
MEM CARD COMPACTFLASH 16GB SLC |
0 |
|
 |
ATP Electronics, Inc. |
MEMORY CARD CFAST 32GB SLC |
3 |
|
Memory Cards are removable storage devices used for data storage and transfer in electronic devices. They utilize flash memory technology to retain data without power supply. These compact modules play a critical role in consumer electronics, industrial equipment, and enterprise systems by enabling portable storage solutions with varying capacities and speeds.
| Type | Functional Features | Application Examples |
|---|---|---|
| SD Card (Secure Digital) | Standardized form factor, supports FAT32/exFAT file systems | Digital cameras, laptops |
| microSD | Smallest physical size with adapter compatibility | Smartphones, drones |
| CFast/C CompactFlash | High-speed interfaces (SATA/PCIe), industrial-grade durability | Professional DSLR cameras |
| NVMe SSD Modules | PCIe interface with advanced parallelism | High-performance computing |
Typical memory card consists of: - NAND flash memory chips (storage medium) - Controller IC (manages data operations) - Physical interface (e.g., UHS-II, PCIe) - Protective casing with contact pads - Error correction and wear-leveling circuitry
| Parameter | Description | Importance |
|---|---|---|
| Storage Capacity | 128MB-1TB range | Determines data volume capability |
| Read/Write Speed | 10-3500MB/s range | Affects data transfer efficiency |
| Interface Type | SD UHS-II, PCIe 4.0 | Dictates compatibility and speed ceiling |
| Endurance Rating | 1,000-100,000 P/E cycles | Measures lifespan for write-intensive applications |
| Operating Temperature | -25 C to +85 C | Defines environmental reliability |
Primary industries include: - Consumer Electronics (smartphones, tablets) - Industrial Automation (PLC systems, data loggers) - Medical Devices (portable diagnostics equipment) - Automotive (dash cams, autonomous driving systems) - Aerospace (flight data recorders)
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| SanDisk | Extreme Pro microSDXC | 1TB, 160MB/s read, A2 rating |
| Samsung | EVO Plus SD Card | 256GB, UHS-I, 130MB/s |
| Kioxia | CFast 2.0 Card | 64GB, 550MB/s, industrial temp range |
| Western Digital | Ultrastar SN530 NVMe | 3.2TB, PCIe 4.0, 750,000 IOPS |
Key considerations: - Match interface compatibility with host device - Prioritize speed class for specific workloads (e.g., 4K video recording) - Evaluate environmental requirements (temperature, shock resistance) - Consider total cost of ownership vs. endurance rating - Verify file system support for capacity requirements
Emerging trends include: - Adoption of PCIe 5.0 interfaces for 10,000MB/s+ speeds - 3D NAND stacking for terabit-level capacities - AI-optimized storage with on-card processing - Increased demand for automotive-grade memory modules - Standardization of CXL interface for low-latency applications