Bobbins (Coil Formers), Mounts, Hardware

Image Part Number Description / PDF Quantity Rfq
TGP-P18/11-C

TGP-P18/11-C

FERROXCUBE

TAG PLATE

1695

CON-P30/19

CON-P30/19

FERROXCUBE

CONTAINER

346

CLM-E25/10/6

CLM-E25/10/6

FERROXCUBE

U SHAPED CLIP

0

BPL/D-CLM/C-P14/8-C

BPL/D-CLM/C-P14/8-C

FERROXCUBE

BASE PLATE

1467

CSV-PQ40/40-1S-12P

CSV-PQ40/40-1S-12P

FERROXCUBE

COIL FORMER VERTICAL

240

CP-P26/16-1S

CP-P26/16-1S

FERROXCUBE

COIL FORMER

0

CPH-E42/21/15-1S-10P

CPH-E42/21/15-1S-10P

FERROXCUBE

COIL FORMER HORIZONTAL

707

SPR-EP10

SPR-EP10

FERROXCUBE

SPRING

127

TGP-P30/19-C

TGP-P30/19-C

FERROXCUBE

TAG PLATE

184

SPR-E20/10/5

SPR-E20/10/5

FERROXCUBE

SPRING

0

CLA-EP20-Z

CLA-EP20-Z

FERROXCUBE

CLAMP

2369

CLI-RM7/I

CLI-RM7/I

FERROXCUBE

CLIP

4449

CP-P18/11-3S

CP-P18/11-3S

FERROXCUBE

COIL FORMER

1468

CSH-E16/8/5-1S-6P-C

CSH-E16/8/5-1S-6P-C

FERROXCUBE

COIL FORMER HORIZONTAL

1213

CP-P36/22-1S

CP-P36/22-1S

FERROXCUBE

COIL FORMER

800

CP-P9/5-1S

CP-P9/5-1S

FERROXCUBE

COIL FORMER

1180

CPH-E32/16/9-1S-12P

CPH-E32/16/9-1S-12P

FERROXCUBE

COIL FORMER HORIZONTAL

0

CLA-EP17

CLA-EP17

FERROXCUBE

CLAMP

236

CP-E30/15/7-1S

CP-E30/15/7-1S

FERROXCUBE

COIL FORMER

748

CLA-EP13-C

CLA-EP13-C

FERROXCUBE

CLAMP

0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Transformer BobbinsProvide winding support with insulation barriersSwitch-mode power supplies (SMPS), AC/DC converters
Inductor Coil FormersEnable precise winding geometry for inductance controlDC/DC converters, EMI filters
PCB MountsSecure components to printed circuit boardsTelecom equipment, automotive ECUs
Core ClampsMechanical fixation for ferrite/powder coresHigh-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

  • Central core with winding windows
  • Insulation barriers (e.g., UL-certified materials)
  • Termination options: PCB pins, wire terminals
  • Thermal vias for heat dissipation

Mounts/hardware feature:

  • Anti-vibration rubber
  • Corrosion-resistant platings (nickel, zinc)
  • Adjustable positioning brackets

4. Key Technical Specifications

ParameterImportance
Temperature Resistance (130-200 C)Determines thermal stability and lifespan
Dielectric Strength (>2kV)Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)Impacts winding machine compatibility
Tensile Strength (>50MPa)Prevents mechanical deformation under load
Surface Resistivity (10^12 )Prevents leakage current paths

5. Application Fields

  • Power Electronics: 5G base station PSUs, solar inverters
  • Automotive: On-board chargers (OBC), 48V DC/DC converters
  • Industrial: CNC machine power supplies, motor drives
  • Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

ManufacturerRepresentative Products
TDK-LambdaCompact PCB-mount bobbin series for telecom
Sumec CorporationHigh-temp composite coil formers
Eaton ElectronicsVibration-resistant inductor mounts
Fastron ICCustomizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

  • Material compatibility with expected operating temperatures
  • Dimensional matching to core geometries (ETD, PQ, RM types)
  • Vibration resistance for automotive applications
  • RoHS compliance for environmental regulations
  • Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

  • Miniaturization through liquid crystal polymer (LCP) materials
  • Integrated cooling channels in bobbin designs
  • Smart mounts with embedded temperature sensors
  • Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.

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