Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B65522B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 9 X 5	3547
B66302D1008T002 TDK EPCOS	BOBBIN COIL FORMER E 8.8	2946
B66414B2000X000 TDK EPCOS	YOKE EFD 15 X 8 X 5	9427
B65812B3003X022 TDK EPCOS	ADJUSTMENT SCREW RM 8	3507
B65806N1104D001 TDK EPCOS	COIL FORMER RM5 SUMIKON PM 9630	0
B65804N1106D001 TDK EPCOS	BOBBIN RM4 SUMIKON PM 9630	2428
B65512C2001X000 TDK EPCOS	YOKE P 7 X 4	1354
B66230A2010X000 TDK EPCOS	YOKE E 32 X 16 X 9	247
B64293A1000X000 TDK EPCOS	BASE PLATE TOROIDS	82
B65804P2203X000 TDK EPCOS	CLAMP RM 4	2319
B66208L1009T001 TDK EPCOS	BOBBIN COIL FORMER E 25 X 13 X 7	337
B65679E0003X022 TDK EPCOS	ADJUSTMENT SCREW P 26 X 16	1218
B64291A1004X000 TDK EPCOS	HOUSING HORIZONTAL TOROIDS	39
B64292A1404X000 TDK EPCOS	HOUSING VERTICAL TOROIDS	173
B65880E2012D001 TDK EPCOS	BOBBIN COIL FORMER PQ 32 X 30	905
B66398A2000X000 TDK EPCOS	YOKE ETD 59 X 31 X 22	595
B65842W1008D001 TDK EPCOS	BOBBIN COIL FORMER EP 10	1617
B65527B1008T001 TDK EPCOS	BOBBIN COIL FORMER ER 9.5 X 5	1158
B65655B0010X000 TDK EPCOS	MOUNTING ASSEMBLY P 18 X 11	236
B65848S2000X000 TDK EPCOS	MOUNTING ASSEMBLY EP 20	122

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.