| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Samsung Electro-Mechanics |
CAP KIT CER 10PF-2.2UF 3000PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CERAMIC 1PF-10UF 3200PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CER 0.01UF-100UF 2000PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CERAMIC 0.1UF-47UF 400PC |
0 |
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Samsung Electro-Mechanics |
CAP KIT CER 0.5PF-10UF 2950PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CER 0.68PF-47UF 3000PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CERAMIC 1PF-10UF 2900PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CERAMIC 2.2UF-47UF 750PC |
0 |
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Samsung Electro-Mechanics |
CAP KIT CER 0.2PF-27PF 2200PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CER 2.2PF-100UF 2750PCS |
0 |
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Samsung Electro-Mechanics |
CAP KIT CERAMIC 0.4PF-1UF 1650PC |
0 |
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Kits Capacitor Kits are modular electronic component packages containing capacitors with varying specifications. These kits provide engineers and researchers with standardized solutions for circuit design, prototyping, and educational purposes. As fundamental elements in electronic systems, capacitors store electric charge, filter signals, and stabilize voltage. Modern advancements in materials science and miniaturization have significantly enhanced their performance in applications ranging from consumer electronics to aerospace systems.
| Type | Key Features | Applications |
|---|---|---|
| Ceramic Capacitor Kit | High dielectric stability, compact size, wide capacitance range (pF- F) | Decoupling circuits, RF filters |
| Electrolytic Capacitor Kit | Polarized design, high capacitance density ( F-mF), voltage-dependent | Power supply smoothing |
| Film Capacitor Kit | Non-polarized, low leakage current, excellent frequency response | Audio crossover networks |
| Supercapacitor Kit | Ultra-high capacitance (F-kF), rapid charge/discharge cycles | Energy storage systems |
Standard capacitor kits feature: - Dielectric Layer: Ceramic (X7R/X5R), aluminum oxide, or polymer films Electrode Materials: Silver palladium (ceramic), aluminum foil (electrolytic) - Encapsulation: Epoxy resin or plastic housing with color-coded markings - Termination: Axial/radial leads or SMD pads with tin-plated surfaces
| Parameter | Significance | Typical Range |
|---|---|---|
| Capacitance (C) | Determines charge storage capacity | 1pF-1000 F |
| Voltage Rating (V) | Maximum operating voltage | 2.5V-1kV |
| Tolerance | Manufacturing precision level | 1% to 20% |
| ESR ( ) | Impacts high-frequency performance | 0.01-10 |
| Temperature Coefficient | Stability over operating range | -55 C to +150 C |
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| TDK | C3225X5R1C226M | 22 F, 16V, X5R dielectric |
| Kemet | C0805C103KRC | 10nF, 10%, 50V rating |
| Vishay | 193B225K25 | 2.2 F, 25V, radial lead |
| AVX | 0603YC104KAT2A | 100nF, 10%, 10V |
Key selection criteria include: 1. Circuit Requirements: Operating voltage and frequency range 2. Environmental Factors: Temperature extremes and humidity 3. Mounting Type: Through-hole vs SMD compatibility 4. Cost Constraints: Balancing performance and budget 5. Supply Chain: Vendor reliability and lead times
Current development trends include: - Miniaturization: 0201-sized components for wearable devices - High-Temperature Stability: Capacitors operable beyond 200 C - Smart Integration: Embedded capacitors with IoT monitoring - Environmental Compliance: Lead-free termination processes - Advanced Dielectrics: Nanoceramic and graphene-enhanced materials