ample-chip ample-chip
RFQ
BOM

Specialized ICs

Image Part Number Description / PDF Quantity Rfq
XC7SH86GW

XC7SH86GW

Nexperia

NOW NEXPERIA XC7SH86GW - XOR GAT

0
BZT52-C2V4,115

BZT52-C2V4,115

Nexperia

BZT52-C2V4 - ZENER DIODE IN A SO

39000
BZX84-B3V6235

BZX84-B3V6235

Nexperia

NOW NEXPERIA BZX84-B3V6 - ZENER

60000
BC55PAS,115

BC55PAS,115

Nexperia

BC55PAS - 45V/60V/80V, 1 A NPN M

12000
PZT2907A115

PZT2907A115

Nexperia

NOW NEXPERIA PZT2907A - POWER BI

0
PDZ12BGW,118

PDZ12BGW,118

Nexperia

SINGLE ZENER DIODE IN A SOD123 P

10000
PHPT61002PYC,115

PHPT61002PYC,115

Nexperia

POWER BIPOLAR TRANSISTOR, 2A, 10

0
BZT52-C3V3,118

BZT52-C3V3,118

Nexperia

ZENER DIODE, 3.3V, 4.99%, 0.41W,

31061
BZT52-B6V2,118

BZT52-B6V2,118

Nexperia

SINGLE ZENER DIODES IN A SOD123

20000
BAS21J

BAS21J

Nexperia

BAS21J - SINGLE HIGH-SPEED SWITC

0
PDZ12BGW115

PDZ12BGW115

Nexperia

SINGLE ZENER DIODE

2700
74VHCT245D118

74VHCT245D118

Nexperia

NOW NEXPERIA 74VHCT245D - BUS TR

16000
PSMN018-80YS115

PSMN018-80YS115

Nexperia

NOW NEXPERIA 45A, 80V, 0.018OHM,

0
BUK9D23-40E,115

BUK9D23-40E,115

Nexperia

POWER FIELD-EFFECT TRANSISTOR

0
BAS116H

BAS116H

Nexperia

NOW NEXPERIA BAS116H - RECTIFIER

0
BCP53-16T,115

BCP53-16T,115

Nexperia

POWER BIPOLAR TRANSISTOR

175000
BUK9605-30A

BUK9605-30A

Nexperia

NOW NEXPERIA BUK9605-30A - POWER

0
BZV55-C12

BZV55-C12

Nexperia

BZV55 SERIES - VOLTAGE REGULATOR

0
BZT52-B12,118

BZT52-B12,118

Nexperia

SINGLE ZENER DIODES IN A SOD123

20000
PMEG6010CEJ115

PMEG6010CEJ115

Nexperia

NOW NEXPERIA PMEG6010CEJ - RECTI

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
RFQ BOM Call Skype Email
Top