Specialized ICs

Part Number	Description / PDF	Quantity
NCV7462DQ1R2G Sanyo Semiconductor/ON Semiconductor	IC TXRX CAN LIN 250MA LDO 36SSOP	0
NCV7694MW0R2G Sanyo Semiconductor/ON Semiconductor	SAFETY CONTROLLER FOR INFRA-RED	3000
CS8190EDWFR20G Sanyo Semiconductor/ON Semiconductor	IC DRIVER 20SOIC	11442
FGBS3040E1-F085 Sanyo Semiconductor/ON Semiconductor	IC IGNITION COIL DRIVER D2PAK	341
FSSD06BQX Sanyo Semiconductor/ON Semiconductor	IC MULTIPLEXER 24MLP	1422
FSSD06UMX Sanyo Semiconductor/ON Semiconductor	IC MULTIPLEXER 24UMLP	262
NCV7450DB0R2G Sanyo Semiconductor/ON Semiconductor	CAN 250MA LDO HS DRV	0
FAN7071TS Sanyo Semiconductor/ON Semiconductor	IC LANDING CORRECTION 10SIPHD	0
NM95HS02EN14 Sanyo Semiconductor/ON Semiconductor	IC ENCODER 14DIP	0
NM95HS01EM8 Sanyo Semiconductor/ON Semiconductor	IC ENCODER 8SO	0
NBSG16VSMNR2G Sanyo Semiconductor/ON Semiconductor	IC TRANSCEIVER 16QFN	0
NBSG16VSMAG Sanyo Semiconductor/ON Semiconductor	IC TRANSCEIVER 16QFN	0
NM95HS02N Sanyo Semiconductor/ON Semiconductor	IC ENCODER 8DIP	0
CS8190EDWFR20 Sanyo Semiconductor/ON Semiconductor	IC DRIVER 20SOIC	0
NM95HS02N14 Sanyo Semiconductor/ON Semiconductor	IC ENCODER 14DIP	0
NM95HS02EM8 Sanyo Semiconductor/ON Semiconductor	IC ENCODER 8SO	0
CD4529BCN Sanyo Semiconductor/ON Semiconductor	IC DUAL 4 SGL CHANNEL DATA 16DIP	0
NM95HS02EM Sanyo Semiconductor/ON Semiconductor	IC ENCODER 14SOIC	0
CS8190ENF16G Sanyo Semiconductor/ON Semiconductor	IC DRIVER 16DIP	0
NM95HS01EM Sanyo Semiconductor/ON Semiconductor	IC ENCODER 14SOIC	0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs