Specialized ICs

Part Number	Description / PDF	Quantity
S82750LH Intel	MICROPROCESSOR CIRCUIT, CMOS, PQ	588
GDLXT121010BC.A2 Intel	GDLXT121010BC.A2	0
PDLXP604NE.B1 Intel	PDLXP604NE.B1	980
PEF55016EV21 Intel	GEMINAX-D16 PRO E V2.1 16-CHANNE	28000
AT80602000771AA Intel	INTEL XEON X5550 SERVER CPU	4571
BD3450 S LGZY Intel	INTELCHIPSETS 3450 CHIPSET SERVE	46800
JGE7501MC Intel	INTEL E7501 MEMORY CONTROLLER HU	0
AT80602000756AD Intel	INTEL XEON W5580 OEM CPU	1503
DZPD6833YCA Intel	DZPD6833YCA	0
SPD6832QCB Intel	SPD6832QCB	0
BD82QS77 S LJ8B Intel	BD82QS77 - MOBILE INTEL QS77 EXP	40000
JHL5320 S LL3A Intel	I/O CONTROLLER INTERFACE IC DISC	8254
AF82SM35 Intel	INTEL SM35 EXPRESS CHIPSET	47500
BD82HM75 S LJ8F Intel	BD82HM75 - MOBILE INTEL HM75 EXP	31500
JHL5320 S LL39 Intel	I/O CONTROLLER INTERFACE IC DISC	285600
SPD6730QCB Intel	SPD6730QCB	0
MG82380-16 Intel	MICRO PERIPHERAL IC	1
BD82HM70 S JTNV Intel	BD82HM70 - MOBILE INTEL HM70 EXP	268650
SST10026QE.A4 Intel	SST10026QE.A4	0
NH82801GBM Intel	CHIPSET 82801GBM SL8YB PBGA652	683789

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs