Specialized ICs

Image Part Number Description / PDF Quantity Rfq
PCA9535CPW118

PCA9535CPW118

NXP Semiconductors

PARALLEL I/O PORT 16-BIT 16 I/

11283

SC16IS740IPW/Q900128

SC16IS740IPW/Q900128

NXP Semiconductors

SINGLE UART WITH I2C-BUS/SPI INT

4410

BF824235

BF824235

NXP Semiconductors

NOW NEXPERIA RF SMALL SIGNAL BIP

10000

74LVC1G11GW-Q100,125

74LVC1G11GW-Q100,125

NXP Semiconductors

NOW NEXPERIA 74LVC1G11GW - AND G

0

BZX585-C3V6135

BZX585-C3V6135

NXP Semiconductors

NOW NEXPERIA BZX585-C3V6 - ZENER

68540

BGA6130118

BGA6130118

NXP Semiconductors

IC AMP ISM 400MHZ-2.7GHZ 8HVSON

106

74ALVCH16374DGG112

74ALVCH16374DGG112

NXP Semiconductors

NOW NEXPERIA 74ALVCH16374DGG - B

5898

BUJ105AB118

BUJ105AB118

NXP Semiconductors

NOW WEEN - BUJ105AB - POWER BIPO

5600

MC34VR500V1ES557

MC34VR500V1ES557

NXP Semiconductors

SWITCHING REGULATOR 13.7A 4000

0

74LVC1G86GW-Q100,125

74LVC1G86GW-Q100,125

NXP Semiconductors

NOW NEXPERIA 74LVC1G86GW-Q100 -

305639

2PC4081R

2PC4081R

NXP Semiconductors

2PC4081 - NPN GENERAL-PURPOSE TR

0

MC34PF3000A6EP557

MC34PF3000A6EP557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT AD

0

BAV170M315

BAV170M315

NXP Semiconductors

NOW NEXPERIA BAV170M - RECTIFIER

480000

BZX84J-C2V4115

BZX84J-C2V4115

NXP Semiconductors

NOW NEXPERIA BZX84J-C2V4 ZENER D

48000

PCA8550PW118

PCA8550PW118

NXP Semiconductors

IC I2C EEPROM DIP SWITCH 16TSSOP

462

PN5331B3HN/C270518

PN5331B3HN/C270518

NXP Semiconductors

USB NFC INTEGRATED SOLUTION

1019

PDTC144VT215

PDTC144VT215

NXP Semiconductors

NOW NEXPERIA PDTC144VT - SMALL S

403360

S9S12G192F0CLL557

S9S12G192F0CLL557

NXP Semiconductors

MICROCONTROLLER 16-BIT, HCS12 C

0

PCA9671PW118

PCA9671PW118

NXP Semiconductors

IC I/O EXPANDER I2C 16B 24TSSOP

18090

BZX84-C5V6/CH,235

BZX84-C5V6/CH,235

NXP Semiconductors

ZENER DIODE, 5.6V V(Z), 5%, 0.25

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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