ample-chip ample-chip
RFQ
BOM

Specialized ICs

Image Part Number Description / PDF Quantity Rfq
BZX79-B4V7143

BZX79-B4V7143

NXP Semiconductors

NOW NEXPERIA BZX79-B4V7 - ZENER

0
MKL27Z256VFM4557

MKL27Z256VFM4557

NXP Semiconductors

KINETIS KL27: MICROCONTROLLER CO

0
TJA1055T/1118

TJA1055T/1118

NXP Semiconductors

ENHANCED FAULT-TOLERANT CAN TRAN

525287
PIMD3115

PIMD3115

NXP Semiconductors

PIMD3 - NPN/PNP RESISTOR-EQUIPPE

0
TEA19362T/1118

TEA19362T/1118

NXP Semiconductors

GREENCHIP SMPS PRIMARY SIDE CONT

180000
NXH2261UK/A1BSCZ

NXH2261UK/A1BSCZ

NXP Semiconductors

NXH2261UK - NFMI RADIO FOR WIREL

0
PMEG2002AESFB,315

PMEG2002AESFB,315

NXP Semiconductors

PMEG2002AESFB - 20V, 0.2A LOW VF

9000
BAS21J/ZL

BAS21J/ZL

NXP Semiconductors

BAS21J - SINGLE HIGH-SPEED SWITC

0
P2020NXE2KHC557

P2020NXE2KHC557

NXP Semiconductors

QORIQ RISC MICROPROCESSOR 32-BI

0
PMEG060V050EPD139

PMEG060V050EPD139

NXP Semiconductors

NOW NEXPERIA PMEG060V050EPD - RE

0
PTVS15VP1UP115

PTVS15VP1UP115

NXP Semiconductors

NOW NEXPERIA PTVS15VP1UP - TRANS

0
TJA1024HG

TJA1024HG

NXP Semiconductors

QUAD LIN 2.2A/SAE J2602 TRANSCEI

0
PCA9634D

PCA9634D

NXP Semiconductors

LED DRIVER 8-SEGMENT

0
NX2301P215

NX2301P215

NXP Semiconductors

NOW NEXPERIA SMALL SIGNAL FIELD-

0
NT3H1101W0FHK125

NT3H1101W0FHK125

NXP Semiconductors

NTAG I2C 1K - ENERGY HARVESTING

0
PH2525L115

PH2525L115

NXP Semiconductors

NOW NEXPERIA PH2525L 100A, 25V,

0
BAS16GW118

BAS16GW118

NXP Semiconductors

NEXPERIA, BAS16GW - HIGH-SPEED S

0
PDTC114YQA147

PDTC114YQA147

NXP Semiconductors

NOW NEXPERIA PDTC114YQA SMALL SI

99000
BLF2425M8LS140112

BLF2425M8LS140112

NXP Semiconductors

NOW AMPLEON, BLF2425M8LS140, POW

1
BUK964R2-55B/C

BUK964R2-55B/C

NXP Semiconductors

N-CHANNEL TRENCHMOS LOGIC LEVEL

3200

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
RFQ BOM Call Skype Email
Top