ample-chip ample-chip
RFQ
BOM

Specialized ICs

Image Part Number Description / PDF Quantity Rfq
74AHC2G32DC125

74AHC2G32DC125

NXP Semiconductors

NOW NEXPERIA 74AHC2G32DC - OR GA

3000
PCF7952ATT/M1CC15118

PCF7952ATT/M1CC15118

NXP Semiconductors

ACTIC-PRO KEYLESS ENTRY IC

22000
MK20DX256VLH7557

MK20DX256VLH7557

NXP Semiconductors

KINETIS K20: 72MHZ CORTEX-M4 PER

2251
MKE02Z32VLC4557

MKE02Z32VLC4557

NXP Semiconductors

KINETIS KE02: MICROCONTROLLER CO

0
PZU5.6B3A115

PZU5.6B3A115

NXP Semiconductors

NOW NEXPERIA PZU5.6B3A ZENER DIO

9000
BCW60C235

BCW60C235

NXP Semiconductors

NOW NEXPERIA SMALL SIGNAL BIPOLA

10000
NZX3V9C133

NZX3V9C133

NXP Semiconductors

NOW NEXPERIA NZX3V9C - ZENER DIO

7000
BZX84-A12215

BZX84-A12215

NXP Semiconductors

NOW NEXPERIA BZX84-A11 - ZENER D

0
NZX12B133

NZX12B133

NXP Semiconductors

SINGLE ZENER DIODE

0
BZX585-C36115

BZX585-C36115

NXP Semiconductors

NOW NEXPERIA BZX585-C36 ZENER DI

153000
PZU3.0BA115

PZU3.0BA115

NXP Semiconductors

SINGLE ZENER DIODE

0
74LVC1G125GV

74LVC1G125GV

NXP Semiconductors

NOW NEXPERIA 74LVC1G125GV - BUS

0
74LVCH2T45GM125

74LVCH2T45GM125

NXP Semiconductors

NOW NEXPERIA 74LVCH2T45GM - BUS

24000
MKL16Z64VLH4557

MKL16Z64VLH4557

NXP Semiconductors

KINETIS KL16: MICROCONTROLLER CO

0
PCF85163T/1518

PCF85163T/1518

NXP Semiconductors

REAL-TIME CLOCK AND CALENDAR

33508
PESD5V0F1BRSF315

PESD5V0F1BRSF315

NXP Semiconductors

NOW NEXPERIA PESD5V0F1BRSF TRANS

18000
S912XHY256F0VLM557

S912XHY256F0VLM557

NXP Semiconductors

16-BIT MCU, S12 CORE, 256KB FLAS

70
MC9S12DG128CPVE557

MC9S12DG128CPVE557

NXP Semiconductors

MICROCONTROLLER 16-BIT FLASH,

0
1PS76SB21145

1PS76SB21145

NXP Semiconductors

NOW NEXPERIA 1PS76SB21 - RECTIFI

60000
TJF1051T/CM118

TJF1051T/CM118

NXP Semiconductors

GALVANICALLY ISOLATED HIGH-SPEED

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
RFQ BOM Call Skype Email
Top