Specialized ICs

Image Part Number Description / PDF Quantity Rfq
AT89S54-SLSUM

AT89S54-SLSUM

Atmel (Microchip Technology)

AT89S54 - MICROCONTROLLER, 8-BIT

83

AT89C5131A-PURUM

AT89C5131A-PURUM

Atmel (Microchip Technology)

AT89C5131 - MICROCONTROLLER, 8-B

22

AT42QT1010-MAH

AT42QT1010-MAH

Atmel (Microchip Technology)

PROXIMITY - TOUCH SENSOR, 1 FUNC

0

AT25020BMAHLT

AT25020BMAHLT

Atmel (Microchip Technology)

AT25020 - EEPROM, 256X8, SERIAL

5000

AT42QT1060-MMU

AT42QT1060-MMU

Atmel (Microchip Technology)

PROXIMITY - TOUCH SENSOR, 1 FUNC

1304

AT88SC3216C-PU

AT88SC3216C-PU

Atmel (Microchip Technology)

EEPROM, 32KX1, SERIAL, CMOS, PDI

957

ATTINY45 15MT1

ATTINY45 15MT1

Atmel (Microchip Technology)

ATTINY45 - RISC MICROCONTROLLER,

6000

AT25320BSSHLT

AT25320BSSHLT

Atmel (Microchip Technology)

AT25320 - EEPROM, 4KX8, SERIAL

4000

ASAM4N16CA-CFU

ASAM4N16CA-CFU

Atmel (Microchip Technology)

ASAM4N16CA-CFU

0

AT89S58-3CSUM

AT89S58-3CSUM

Atmel (Microchip Technology)

AT89S58 - MICROCONTROLLER, 8-BIT

0

AT88SC0204CA-SH

AT88SC0204CA-SH

Atmel (Microchip Technology)

AT88SC0 - CRYPTOMEMORY, 2KX1

4883

AT42QT1040-MMH

AT42QT1040-MMH

Atmel (Microchip Technology)

PROXIMITY - TOUCH SENSOR, 1 FUNC

4136

ATSHA204-TH-CZ-T

ATSHA204-TH-CZ-T

Atmel (Microchip Technology)

CRYPTOAUTHENTICATION, 4KX1, CMOS

4750

AT76C517-1-JCT100

AT76C517-1-JCT100

Atmel (Microchip Technology)

AT76C517-1-JCT100

0

AT90USB16AU

AT90USB16AU

Atmel (Microchip Technology)

RISC MICROCONTROLLER, 8-BIT, FLA

0

AT28C256E-15FM883

AT28C256E-15FM883

Atmel (Microchip Technology)

AT28C256E - EEPROM, 32KX8, 150NS

15

ATMXT1716EEGV-Z2U

ATMXT1716EEGV-Z2U

Atmel (Microchip Technology)

MAXTOUCH 1716 CHANNEL TOUCHSCREE

520

AT89S58-SLSUM

AT89S58-SLSUM

Atmel (Microchip Technology)

AT89S58 - MICROCONTROLLER, 8-BIT

0

EGA88V-10MU

EGA88V-10MU

Atmel (Microchip Technology)

EGA88V-10MU

0

ATMXT768E-ATR

ATMXT768E-ATR

Atmel (Microchip Technology)

MAXTOUCH 768 CHANNEL TOUCHSCREEN

10000

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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