Specialized ICs

Image Part Number Description / PDF Quantity Rfq
DF36109FWV

DF36109FWV

Renesas Electronics America

HD64F36109 - H8/300H TINY MICROC

3243

RD9.1F-T7

RD9.1F-T7

Renesas Electronics America

RD9.1F - ZENER DIODE

5000

2SB564-T-AZ

2SB564-T-AZ

Renesas Electronics America

2SB564 - SIGNAL DEVICE

18000

72V51446L7-5BB8

72V51446L7-5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

RD39F-T7-AZ

RD39F-T7-AZ

Renesas Electronics America

RD39F - ZENER DIODE

2500

RD12E(N)-T2-AZ

RD12E(N)-T2-AZ

Renesas Electronics America

RD12E - ZENER DIODE

15000

UPC3623GB(A1)-1A7

UPC3623GB(A1)-1A7

Renesas Electronics America

UPC3623GB(A1)-1A7

0

E-562-E

E-562-E

Renesas Electronics America

E-562-E

0

RBK02P04GQT-0000#GCH

RBK02P04GQT-0000#GCH

Renesas Electronics America

RBK02P04GQT-0000#GCH

60000

72V51256L7-5BB8

72V51256L7-5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

R2J20759NP#G0

R2J20759NP#G0

Renesas Electronics America

R2J20759NP#G0

0

M34508G4HFP#U0

M34508G4HFP#U0

Renesas Electronics America

4-8BIT GENERAL MCU

177

M30290FCVHP#U3A

M30290FCVHP#U3A

Renesas Electronics America

MICROCONTROLLER, 16-BIT, FLASH,

44801

DF36079GHSWV

DF36079GHSWV

Renesas Electronics America

HD64F36079 - H8/300H TINY MICROC

264

RQT1010TMTL-H#H6

RQT1010TMTL-H#H6

Renesas Electronics America

RQT1010TMTL-H#H6

0

72V51253L6BB8

72V51253L6BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

R5F3650EDFB#VA

R5F3650EDFB#VA

Renesas Electronics America

R5F3650 - 16-BIT GENERAL MCU

495

80HCPS1848CRMI

80HCPS1848CRMI

Renesas Electronics America

IC SER RAPIDIO SWITCH 784FCBGA

11

M30290FCTHP#UFQ

M30290FCTHP#UFQ

Renesas Electronics America

MICROCONTROLLER, 16-BIT, FLASH,

1785

N0301N-T1-AT

N0301N-T1-AT

Renesas Electronics America

N-CHANNEL MOS FIELD EFFECT TRANS

6000

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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