Specialized ICs

Image Part Number Description / PDF Quantity Rfq
72T6360L6BBG

72T6360L6BBG

Renesas Electronics America

IC SEQUENTIAL FLOW-CTRL 324PBGA

0

TSI576-10GILY

TSI576-10GILY

Renesas Electronics America

IC SER RAPIDIO SWITCH 399FCBGA

0

8440258AKI-45LF

8440258AKI-45LF

Renesas Electronics America

IC LVDS/LVCMOS FREQ SYN 32VFQFPN

0

844201BKI-45LF

844201BKI-45LF

Renesas Electronics America

IC CLOCK GENERATOR 16VFQFPN

0

IDT72T6480L7-5BB

IDT72T6480L7-5BB

Renesas Electronics America

IC SEQUENTIAL FLOW-CTRL 324PBGA

0

843242AGLFT

843242AGLFT

Renesas Electronics America

IC LVPECL FREQ SYNTH 16TSSOP

0

80HCPS1432HM

80HCPS1432HM

Renesas Electronics America

IC SER RAPIDIO SWITCH 576FCBGA

0

8N3PG10MBKI-161LF

8N3PG10MBKI-161LF

Renesas Electronics America

IC LVPECL SYNTHESIZER 10VFQFPN

0

80HCPS1432CRM

80HCPS1432CRM

Renesas Electronics America

IC SER RAPIDIO SWITCH 576FCBGA

0

80HCPS1432CHMI

80HCPS1432CHMI

Renesas Electronics America

IC SER RAPIDIO SWITCH 576FCBGA

0

IDT72T6480L7-5BBG

IDT72T6480L7-5BBG

Renesas Electronics America

IC SEQUENTIAL FLOW-CTRL 324PBGA

0

83PN161AKILFT

83PN161AKILFT

Renesas Electronics America

IC LVPECL SYNTHESIZER 10VFQFPN

0

IDT72P51539L6BBI

IDT72P51539L6BBI

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51359L6BBI8

IDT72P51359L6BBI8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51759L6BB8

IDT72P51759L6BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51759L5BB8

IDT72P51759L5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80KSW0002ALGI8

80KSW0002ALGI8

Renesas Electronics America

IC INTERFACE

0

TSI564A-10GIL

TSI564A-10GIL

Renesas Electronics America

IC SER RAPIDIO SWITCH 399TEPBGA

0

IDT72P51769L5BB8

IDT72P51769L5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80KSW0002RM8

80KSW0002RM8

Renesas Electronics America

IC SERIAL RAPIDIO SWITCH

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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