| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Maxim Integrated |
IC REG QUAD BUCK/LNR SYNC 28SSOP |
0 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Analog Devices, Inc. |
IC REG QUAD BCK/LNR SYNC 24LFCSP |
5369 |
|
 |
Analog Devices, Inc. |
IC REG DL BUCK/LNR SYNC 16MSOP |
0 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Analog Devices, Inc. |
IC REG DL BUCK/LINEAR SYNC 10DFN |
773 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Analog Devices, Inc. |
INVERTING CHARGE PUMP & LOW NOIS |
0 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LNR SYNC 10MSOP |
0 |
|
 |
Analog Devices, Inc. |
IC REG TRIPLE BUCK/BST/LNR 24QFN |
497 |
|
 |
Analog Devices, Inc. |
IC REG DL BOOST/LNR 2.2MHZ 8DFN |
0 |
|
 |
ROHM Semiconductor |
IC REG 17OUT BCK/LNR SYNC 50UCSP |
2497 |
|
 |
Texas Instruments |
IC REG DL BOOST/LNR SYNC 6WSON |
29 |
|
 |
Analog Devices, Inc. |
IC REG DL BUCK/LNR SYNC 16MSOP |
147 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Texas Instruments |
TPS61130 ADJUSTABLE, 90% EFFICIE |
40780 |
|
 |
Intersil (Renesas Electronics America) |
IC REG QUAD BUCK/LNR 3MHZ 16TQFN |
0 |
|
 |
Roving Networks / Microchip Technology |
IC REG DL BUCK/LINEAR SYNC 10DFN |
0 |
|
 |
Maxim Integrated |
IC REG TRIPLE BUCK/BST/LNR 25WLP |
0 |
|
Power Management ICs (PMICs) voltage regulators are semiconductor devices that maintain stable output voltages despite input variations. They are critical in modern electronics for ensuring reliable operation of sensitive components. Linear regulators use resistive control for low-noise outputs, while switching regulators employ high-frequency switching for higher efficiency. These devices enable optimal power distribution in applications ranging from mobile devices to industrial systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Linear Regulators (LDO) | Low noise, simple design, lower efficiency (typically 40-60%), dropout voltage ~0.1V | RF circuits, audio amplifiers, battery-powered devices |
| Buck Converters | Step-down topology, 80-95% efficiency, requires inductor | CPU/GPU power supplies, DC-DC modules |
| Boost Converters | Step-up topology, synchronous design for <90% efficiency | LED drivers, battery backup systems |
| Buck-Boost Converters | Inverting topology, handles input voltage variations | Portable electronics, automotive systems |
Typical voltage regulator ICs consist of: 1) Reference voltage circuit (bandgap), 2) Error amplifier, 3) Pass transistor (MOSFET/BJT), 4) Feedback network, 5) Protection circuits (OCP/OTP). Switching regulators integrate PWM controllers and gate drivers, while linear types use simpler architectures. Common packages include QFN (3x3mm to 5x5mm), TSSOP, and BGA with thermal pads.
| Parameter | Description & Importance |
|---|---|
| Input Voltage Range | Operating limits (e.g., 2.5V-5.5V for LDOs, 4.5V-60V for DC-DC) |
| Output Voltage Accuracy | Tolerance level ( 1% to 5% for precision applications) |
| Efficiency | Power conversion ratio (critical for thermal design) |
| Ripple Rejection | PSRR value (e.g., 60dB@1kHz for noise-sensitive circuits) |
| Transient Response | Stability under load changes (e.g., 50mV deviation for 1A/ s steps) |
| Quiescent Current | Standby consumption (critical for battery life) |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LM2678 | 3A step-down converter, 65V input |
| STMicroelectronics | L7981 | Synchronous buck regulator, 2A output |
| ON Semiconductor | NCP1117 | Low-dropout linear regulator, 1A current |
| Analog Devices | LT8640S | High-efficiency buck converter, 42V input |
Key considerations: 1) Input/output voltage requirements, 2) Load current profile (steady vs. transient), 3) Efficiency vs. noise trade-offs, 4) Thermal management (package thermal resistance), 5) External component requirements (inductors, capacitors), 6) Operating temperature range (-40 C to +125 C automotive grade), 7) Cost vs. integration level.
Current developments include: - Higher integration (PMICs combining multiple rails) - Wide bandgap semiconductors (GaN/SiC for high-frequency switching) - Digital control implementation (PMBus interface adoption) - Advanced packaging (3D stacking for low inductance) - Energy harvesting compatibility (sub-1V input capability) - AEC-Q100 automotive qualification becoming standard