| Image | Part Number | Description / PDF | Quantity | Rfq |
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Wickmann / Littelfuse |
IC TEMP/PWM CONTROLLER 16WQFN |
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Power Management ICs (PMICs) with Thermal Management are integrated circuits responsible for regulating power distribution and monitoring thermal conditions in electronic systems. These devices prevent overheating through active temperature sensing, dynamic power adjustment, and thermal protection mechanisms. Their importance grows with increasing power density in modern electronics like smartphones, servers, and automotive systems, ensuring reliability and longevity.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Temperature Monitoring PMIC | Continuous temperature sensing with alert thresholds | Smartphones, laptops |
| Thermal Protection PMIC | Automatic shutdown during critical temperature events | Industrial motors, battery systems |
| Dynamic Thermal Regulation PMIC | Adjusts power delivery based on real-time thermal feedback | High-performance computing (HPC), 5G base stations |
| Multi-Zone Thermal Control PMIC | Independent monitoring of multiple thermal zones | Automotive ECUs, data center servers |
A typical PMIC thermal management system consists of: - **Temperature Sensors**: Built-in thermistors or diodes for precise thermal detection - **Analog-to-Digital Converters (ADC)**: Convert analog temperature signals to digital values - **Control Logic**: Implements thermal algorithms (e.g., PID controllers) - **Power Switching Elements**: MOSFETs for load control during thermal events - **Communication Interfaces**: I2C/SPI for system integration - **Protection Circuits**: Over-temperature shutdown (OTP) and hysteresis mechanisms
| Parameter | Description | Importance |
|---|---|---|
| Temperature Sensing Accuracy | 1 C to 3 C tolerance range | Determines protection reliability |
| Thermal Protection Threshold | Configurable via registers (e.g., 80 C-150 C) | Prevents silicon degradation |
| Response Time | 10 s-1ms for critical shutdown | Minimizes thermal damage risk |
| Operating Temperature Range | -40 C to +125 C standard | Ensures environmental stability |
| Power Consumption | 10 A-100mA active mode | Impacts battery life in portable devices |
| Package Type | QFN, BGA, TSSOP | Affects thermal dissipation capability |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Texas Instruments | TPS65000 Series | Multi-channel thermal regulation with 1 C accuracy |
| STMicroelectronics | STMPS Series | Integrated ADC and I2C interface for thermal monitoring |
| NXP Semiconductors | PF5000 Series | Digital temperature sensors with programmable thresholds |
| Infineon Technologies | OPTIREG Series | Automotive-grade thermal protection up to 150 C |
| Analog Devices | ADM1031 Hot Swap Controller | Dual-zone temperature monitoring with fan control |
Key considerations when selecting PMIC thermal management solutions: - **Operating Environment**: Industrial vs. consumer temperature requirements - **Thermal Response Speed**: Critical for high-power systems (e.g., GPUs) - **Integration Level**: Combined voltage regulation + thermal management vs. discrete solutions - **Package Thermal Resistance**: Lower R JA improves heat dissipation - **System Compatibility**: Communication interface (I2C vs. PMBus) and voltage range - **Certifications**: Automotive (AEC-Q), Industrial (IEC 60750) standards compliance
Future developments in PMIC thermal management include: - **Advanced Process Nodes**: 28nm/40nm technologies for lower quiescent current - **AI-Driven Thermal Prediction**: Machine learning algorithms for proactive cooling - **GaN/SiC Integration**: Wide-bandgap semiconductor compatibility for high-temperature operation - **Ultra-Small Packaging**: 0.4mm pitch WLCSP for wearable devices - **Standardization Efforts**: Emerging PMIC thermal interface standards (e.g., JEDEC JESD51)