PMIC - Power Distribution Switches, Load Drivers

Part Number	Description / PDF	Quantity
GLF71300 GLF Integrated Power	NANO-CURRENT CONSUMED LOAD SWITC	4000
GLF71311T GLF Integrated Power	NANO-CURRENT CONSUMED LOAD SWITC	3000
GLF71315 GLF Integrated Power	NANO-CURRENT CONSUMED LOAD SWITC	3000
GLF72511 GLF Integrated Power	2A ULTRA LOW CURRENT N-CH ROAD S	3000
GLF76121S GLF Integrated Power	2A NANO CURRENT CONSUMED POWER R	3000
GLF76121L GLF Integrated Power	2A NANO CURRENT CONSUMED POWER R	3000
GLF71301T GLF Integrated Power	NANO-CURRENT CONSUMED LOAD SWITC	3000
GLF72120 GLF Integrated Power	4A SLEW RATE CONTROLLED LOAD SWI	3000
GLF76521 GLF Integrated Power	2A POWER DEEP SLEEP SWITCH	3000
GLF72510 GLF Integrated Power	2A ULTRA LOW CURRENT N-CH ROAD S	3000
GLF78131 GLF Integrated Power	3 CHANNEL NANO IQSMART LOAD SWIT	3000

PMIC - Power Distribution Switches, Load Drivers

1. Overview

Power Management Integrated Circuits (PMICs) featuring Power Distribution Switches and Load Drivers are critical components in modern electronic systems. These devices manage power routing, load control, and protection functions in applications ranging from portable devices to industrial equipment. Power Distribution Switches handle voltage/current path selection, while Load Drivers provide controlled driving capability for high-current loads. Their integration improves system efficiency, reduces component count, and enhances reliability.

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Load Switches	Low R_DS(on), fast turn-on/off, inrush current control	Smartphones, laptops, servers
Distribution Switches	Multi-channel power path management, fault isolation	Automotive systems, industrial PLCs
Smart Load Drivers	Integrated FETs + protection logic, current sensing	Robotics, motor controls, LED lighting
Hot Swap Controllers	Controlled startup, overcurrent/voltage protection	Data center servers, telecom equipment

3. Structure & Composition

Typical components include:

Power MOSFETs (usually NMOS/PMOS) with low on-resistance
Gate drivers and control logic circuits
Protection modules (OCP, OVP, OTP, UVLO)
Current sensing elements (shunt resistors or amplifiers)
Thermal management structures (heat spreaders, thermal vias)

Common packaging: QFN, TSSOP, BGA with exposed thermal pads

4. Key Technical Specifications

Parameter	Description	Importance
R_DS(on)	On-state resistance (1-50 m range)	Directly affects conduction loss
I_MAX	Maximum continuous current (0.5-10A typical)	Determines load capacity
V_SUPPLY	Operating voltage range (2.7-40V typical)	System compatibility factor
t_ON/OFF	Switching transition time (1-100 s)	Affects EMI and power efficiency
Quiescent Current	Standby power consumption ( A range)	Battery life consideration

5. Application Fields

Consumer Electronics: Smartphones (display/backlight drivers), notebooks (peripheral power control)
Automotive: Electric vehicle power distribution, ADAS sensor power management
Industrial: PLCs, motor drives, test equipment
Telecom/Datacom: Server power rails, PoE systems, base stations
Medical: Portable diagnostic devices, imaging equipment

6. Leading Manufacturers & Products

Manufacturer	Product Series	Key Features
Texas Instruments	TPS229xx family	18m R_DS(on), 6A rating, load current monitoring
STMicroelectronics	VN7000 series	Smart high-side switches, automotive qualified
Infineon	BTS7xx series	Integrated diagnostics, 24V operation
ON Semiconductor	NCP380 series	40V tolerant, fast overcurrent protection

7. Selection Recommendations

Key consideration factors:

Current/voltage requirements with safety margins (>20% over spec)
Thermal performance: Junction-to-ambient thermal resistance
Protection features matching application environment
Control interface compatibility (GPIO, I2C, PWM)
Package size vs. board space constraints

Case Study: For a 12V/3A motor driver in an industrial robot, select a device with:

R_DS(on) < 30m to limit loss to <0.27W
Operating temperature range -40 C to 125 C
Integrated current sensing for feedback control

8. Industry Trends

Integration of GaN/SiC FETs for higher efficiency (2024-2030)
Development of bidirectional switches for energy recovery systems
Increasing adoption of digital control interfaces (PMBus compliance)
Tighter functional safety compliance (ISO 26262 for automotive)
Advanced thermal packaging (double-sided cooling, copper pillar technology)