PMIC - Power Distribution Switches, Load Drivers

Image Part Number Description / PDF Quantity Rfq
MC35XS3500HFK

MC35XS3500HFK

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:6 24PQFN

0

MC35XS3400DHFKR2

MC35XS3400DHFKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:4 24PQFN

0

MC08XS6421BEKR2

MC08XS6421BEKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32HSOP

0

MC10XS3535HFKR2

MC10XS3535HFKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:6 24PQFN

0

MC10XS6200BEKR2

MC10XS6200BEKR2

NXP Semiconductors

IC PWR SWITCH 32SOIC

975

MC33882PEPR2

MC33882PEPR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32QFN

0

MC10XS3425EK

MC10XS3425EK

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32HSOP

0

MC10XS3535DHFK

MC10XS3535DHFK

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:6 24PQFN

0

MC40XS6500BEK

MC40XS6500BEK

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32SOIC

0

NX5P2924CUKZ

NX5P2924CUKZ

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 6WLCSP

2674

NX30P0121UKZ

NX30P0121UKZ

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 12WLCSP

2942

MC22XS4200BEK

MC22XS4200BEK

NXP Semiconductors

HIGH-SIDE SWITCH, 24V, DUAL 22MO

1197

MC17XS6400CEKR2

MC17XS6400CEKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32SOIC

985

MC40XS6500BEKR2

MC40XS6500BEKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32SOIC

0

MC35XS3500HFKR2

MC35XS3500HFKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:6 24PQFN

0

MC10XS3435BHFK

MC10XS3435BHFK

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 24PQFN

0

MC17XS6500CEKR2

MC17XS6500CEKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 32SOIC

0

NX18P3001UKZ

NX18P3001UKZ

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 12WLCSP

142

MC33981BHFKR2

MC33981BHFKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 16QFN

820

MC09XS3400AFKR2

MC09XS3400AFKR2

NXP Semiconductors

IC PWR SWITCH N-CHAN 1:1 24PQFN

0

PMIC - Power Distribution Switches, Load Drivers

1. Overview

Power Management Integrated Circuits (PMICs) featuring Power Distribution Switches and Load Drivers are critical components in modern electronic systems. These devices manage power routing, load control, and protection functions in applications ranging from portable devices to industrial equipment. Power Distribution Switches handle voltage/current path selection, while Load Drivers provide controlled driving capability for high-current loads. Their integration improves system efficiency, reduces component count, and enhances reliability.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
Load SwitchesLow RDS(on), fast turn-on/off, inrush current controlSmartphones, laptops, servers
Distribution SwitchesMulti-channel power path management, fault isolationAutomotive systems, industrial PLCs
Smart Load DriversIntegrated FETs + protection logic, current sensingRobotics, motor controls, LED lighting
Hot Swap ControllersControlled startup, overcurrent/voltage protectionData center servers, telecom equipment

3. Structure & Composition

Typical components include:

  • Power MOSFETs (usually NMOS/PMOS) with low on-resistance
  • Gate drivers and control logic circuits
  • Protection modules (OCP, OVP, OTP, UVLO)
  • Current sensing elements (shunt resistors or amplifiers)
  • Thermal management structures (heat spreaders, thermal vias)

Common packaging: QFN, TSSOP, BGA with exposed thermal pads

4. Key Technical Specifications

ParameterDescriptionImportance
RDS(on)On-state resistance (1-50 m range)Directly affects conduction loss
IMAXMaximum continuous current (0.5-10A typical)Determines load capacity
VSUPPLYOperating voltage range (2.7-40V typical)System compatibility factor
tON/OFFSwitching transition time (1-100 s)Affects EMI and power efficiency
Quiescent CurrentStandby power consumption ( A range)Battery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (display/backlight drivers), notebooks (peripheral power control)
  • Automotive: Electric vehicle power distribution, ADAS sensor power management
  • Industrial: PLCs, motor drives, test equipment
  • Telecom/Datacom: Server power rails, PoE systems, base stations
  • Medical: Portable diagnostic devices, imaging equipment

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
Texas InstrumentsTPS229xx family18m RDS(on), 6A rating, load current monitoring
STMicroelectronicsVN7000 seriesSmart high-side switches, automotive qualified
InfineonBTS7xx seriesIntegrated diagnostics, 24V operation
ON SemiconductorNCP380 series40V tolerant, fast overcurrent protection

7. Selection Recommendations

Key consideration factors:

  1. Current/voltage requirements with safety margins (>20% over spec)
  2. Thermal performance: Junction-to-ambient thermal resistance
  3. Protection features matching application environment
  4. Control interface compatibility (GPIO, I2C, PWM)
  5. Package size vs. board space constraints

Case Study: For a 12V/3A motor driver in an industrial robot, select a device with:

  • RDS(on) < 30m to limit loss to <0.27W
  • Operating temperature range -40 C to 125 C
  • Integrated current sensing for feedback control

8. Industry Trends

  • Integration of GaN/SiC FETs for higher efficiency (2024-2030)
  • Development of bidirectional switches for energy recovery systems
  • Increasing adoption of digital control interfaces (PMBus compliance)
  • Tighter functional safety compliance (ISO 26262 for automotive)
  • Advanced thermal packaging (double-sided cooling, copper pillar technology)
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