PMIC - Laser Drivers

Image Part Number Description / PDF Quantity Rfq
PHY1076-01QH-BR

PHY1076-01QH-BR

Maxim Integrated

IC LIMITING AMP LASER 2.5GBPS QF

0

GN1163-INE3

GN1163-INE3

Semtech

IC LASER DRVR 11.9GB 3.3V 24QFN

0

PHY1092-01DS-WR

PHY1092-01DS-WR

Maxim Integrated

IC OPAMP

1600

GN1158-INE3

GN1158-INE3

Semtech

IC LASER DRVR 11.3GB 3.3V 28QFN

0

LV0222CS-TLM-H

LV0222CS-TLM-H

Sanyo Semiconductor/ON Semiconductor

IC LASER MONITOR 8-ODCSP

0

HXT6204-DNT

HXT6204-DNT

Renesas Electronics America

IC CLOCK DRIVER ARRAY VCSEL DIE

0

MAX3738ETG+G05

MAX3738ETG+G05

Maxim Integrated

IC LASER

0

OA3SSQL

OA3SSQL

Microsemi

IC LASER DRVR 32GBPS 3V

0

M02151G-12

M02151G-12

Metelics (MACOM Technology Solutions)

IC OPERATIONAL AMP

0

MAX3604CWG+TCEJ

MAX3604CWG+TCEJ

Maxim Integrated

SINGLE-CHANNEL LASER DRIVER

0

M02066G-51

M02066G-51

Metelics (MACOM Technology Solutions)

IC LASER DRVR 3GBPS 3.63V 24BCC

0

OA3MHQM-2

OA3MHQM-2

Roving Networks / Microchip Technology

IC LASER DRVR 32GBPS 8V

0

MAX24025BIMP+

MAX24025BIMP+

Maxim Integrated

IC LASER DRIVER

0

ISL58792CRTZ

ISL58792CRTZ

Intersil (Renesas Electronics America)

IC LASER DRVR 5.7V 24TQFN

0

GN1161-INE3

GN1161-INE3

Semtech

IC LASER DRVR 11.3GB 3.3V 28QFN

0

M02150G-12

M02150G-12

Metelics (MACOM Technology Solutions)

IC OPERATIONAL AMP

0

MAX3948E/D+

MAX3948E/D+

Maxim Integrated

IC LASER DRIVER 10G

0

MAX3643ETG+TG069

MAX3643ETG+TG069

Maxim Integrated

IC LASER

0

ISL58792CRTZ-T7A

ISL58792CRTZ-T7A

Intersil (Renesas Electronics America)

IC LASER DRVR 5.7V 24TQFN

0

GN25L95-QFN

GN25L95-QFN

Semtech

IC LASER DRVR 2.5GBPS 3.3V 28QFN

0

PMIC - Laser Drivers

1. Overview

Laser drivers in Power Management Integrated Circuits (PMICs) are specialized electronic components designed to control and power laser diodes. They regulate current flow to maintain stable laser output, enable precise modulation, and protect against electrical faults. These drivers are critical in applications requiring high-speed optical signal transmission, precision sensing, and industrial processing.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Continuous-Wave (CW) DriversProvide constant current for steady-state laser operationFiber optic communication systems
Pulsed Laser DriversGenerate high-current pulses for pulsed laser operationLIDAR systems, laser rangefinders
Modulating DriversSupport analog/digital modulation up to GHz frequenciesHigh-speed data transmission
Tunable DriversAllow wavelength adjustment through current/temperature controlSpectroscopy equipment

3. Structure and Components

Typical laser driver architecture includes: - Input power conditioning circuitry - Precision current source with <0.1% regulation - High-speed modulation path (up to 25 Gbps) - Thermal protection and overcurrent detection - Laser diode interface with EMI shielding Advanced packages integrate digital control interfaces (I2C, SPI) and diagnostic feedback systems.

4. Key Technical Specifications

ParameterImportanceTypical Range
Output Current RangeDetermines laser power level10mA - 2.5A
Modulation BandwidthDefines data transmission speedDC - 28 GHz
Current Noise DensityAffects optical signal purity<5 nA/ Hz
Thermal Shutdown ThresholdProtects laser diode integrity125 C - 150 C
Power EfficiencyImpacts system thermal management75% - 92%

5. Application Areas

  • Telecommunications: 100G/400G optical transceivers
  • Medical: Laser surgical equipment, diagnostic imaging
  • Industrial: Laser marking/cutting machines
  • Consumer: 3D sensing in smartphones
  • Automotive: ADAS LIDAR systems

6. Major Manufacturers and Products

ManufacturerProduct SeriesKey Features
Analog DevicesADN284x25 Gbps modulation, integrated TEC control
Texas InstrumentsLMT844-channel driver for LiDAR, 3.5A peak current
STMicroelectronicsLD55xxDigital diagnostic interface, 1.2A output
InfineonIRS2975Automotive grade, 200MHz bandwidth

7. Selection Guidelines

Key consideration factors: - Match output current capabilities with laser diode specifications - Verify modulation bandwidth compatibility with system requirements - Evaluate thermal protection features for reliability - Assess integration level (discrete vs. system-on-chip) - Consider package type (QFN, BGA) for PCB design

8. Industry Trends

Emerging developments include: - Integration with optical feedback loops for closed-loop power control - Development of GaN-based drivers for higher switching frequencies - Implementation of digital telemetry for predictive maintenance - Miniaturization for wearable laser-based sensors - Increased focus on automotive-grade drivers for autonomous vehicles

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