PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5903NNEUT+T

MAX5903NNEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

2608

MAX5977AETP+T

MAX5977AETP+T

Maxim Integrated

IC HOT SWAP CTRLR GP 20TQFN

0

MAX15091AETI+T

MAX15091AETI+T

Maxim Integrated

IC HOT SWAP CTRLR GP 28TQFN

0

MAX5955AEEE+

MAX5955AEEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

1062900

MAX34561T+T

MAX34561T+T

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 24TQFN

0

MAX5925CEUB+T

MAX5925CEUB+T

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

0

MAX5976BETE+

MAX5976BETE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16TQFN

1321020

MAX5926EEE+

MAX5926EEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

831300

MAX5956BUEE+T

MAX5956BUEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5947AESA+T

MAX5947AESA+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

0

MAX5904ESA+T

MAX5904ESA+T

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 8SOIC

7500

MAX5908UEE+T

MAX5908UEE+T

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 16QSOP

0

MAX5978ETJ+T

MAX5978ETJ+T

Maxim Integrated

IC HOT SWAP CTRLR GP 32TQFN

2500

MAX5904USA+T

MAX5904USA+T

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 8SOIC

0

MAX5925DEUB+T

MAX5925DEUB+T

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

0

MAX5914AEMH+T

MAX5914AEMH+T

Maxim Integrated

IC HOT SWAP CTR PWR OVER 44MQFP

0

MAX5911ESA+

MAX5911ESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

4700

MAX5917AESE+

MAX5917AESE+

Maxim Integrated

IC HOT SWAP CTR NETWORKNG 16SOIC

133

MAX5925AEUB+

MAX5925AEUB+

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

70

MAX5934AEEE+T

MAX5934AEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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