PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5938AEEE+

MAX5938AEEE+

Maxim Integrated

IC HOT SWAP CTRLR -48V 16QSOP

1001800

MAX5901NNEUT+T

MAX5901NNEUT+T

Maxim Integrated

IC HOT SWAP CTRLR -48V SOT23-6

0

HIP1011BCB

HIP1011BCB

PCI HOT PLUG CONTROLLER

1000

MAX5959AECS+

MAX5959AECS+

Analog Devices, Inc.

HOT-PLUG CONTROLLER

20

LTC4217IDHC#PBF

LTC4217IDHC#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

3417

UCC3921D

UCC3921D

Texas Instruments

IC HOT SWAP CTRLR GP 8SOIC

27

HIP1011ECAZA

HIP1011ECAZA

Intersil (Renesas Electronics America)

ANALOG CIRCUIT, PDSO28

51

ADM1073ARU

ADM1073ARU

Analog Devices, Inc.

HOT-SWAP CONTROLLER

6360

TPS2300IPW

TPS2300IPW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

20

LTC4219IDHC-12#TRPBF

LTC4219IDHC-12#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

0

LTC4242IG#PBF

LTC4242IG#PBF

Analog Devices, Inc.

DUAL SLOT HOT SWAP CONTROLLER FO

37

TPS2340APFP

TPS2340APFP

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

3238

ISL61863DIRZ

ISL61863DIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

ISL61863GIRZ

ISL61863GIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5947CESA+T

MAX5947CESA+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

0

LTC1645IS#TRPBF

LTC1645IS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 14SOIC

0

MAX5978ETJ+

MAX5978ETJ+

Maxim Integrated

IC HOT SWAP CTRLR GP 32TQFN

1708300

ADM1070ARTZ-REEL7

ADM1070ARTZ-REEL7

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V SOT23-6

3760

TPS2391DGK

TPS2391DGK

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

35

LTC1642CGN#TRPBF

LTC1642CGN#TRPBF

Analog Devices, Inc.

IC HOTSWAP CTR INFINIBAND 16SSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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