PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX15093AGWL+

MAX15093AGWL+

Maxim Integrated

15A EFUSE WITH INTEGRATED FET

9802420

MAX5903LCEUT+T

MAX5903LCEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

2825000

ISL6174IRZ-T

ISL6174IRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR GP 28QFN

0

ISL6161CBZA

ISL6161CBZA

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR PCI EXP 14SOIC

270

ISL61863HIRZ-T

ISL61863HIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

TPS2340APFPR

TPS2340APFPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

11000

ISL61853DCRZ-T

ISL61853DCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

ADM1275-3ACPZ-R7

ADM1275-3ACPZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20LFCSP

0

LTC4225CUFD-1#TRPBF

LTC4225CUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

LTC4251BCS6#TRMPBF

LTC4251BCS6#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V TSOT23-6

206

LT1641IS8#PBF

LT1641IS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

180

LTC4227IUFD-3#PBF

LTC4227IUFD-3#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

348

MAX5939EESA+T

MAX5939EESA+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

2500

LTC4224CDDB-1#TRPBF

LTC4224CDDB-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10DFN

0

LTC4219CDHC-5#PBF

LTC4219CDHC-5#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

127

TPS2492PW

TPS2492PW

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

535

LTC4241CGN#PBF

LTC4241CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 20SSOP

0

LTC4218IGN#TRPBF

LTC4218IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

4355

LTC4283HUHF#PBF

LTC4283HUHF#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

52

SN24710DGSR

SN24710DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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