PMIC - Gate Drivers

Image Part Number Description / PDF Quantity Rfq
1SP0635V2M1-12

1SP0635V2M1-12

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

77

2SC0106T2A1-12

2SC0106T2A1-12

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

708

2SP0320T2A0-12

2SP0320T2A0-12

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

41

IGD515EI

IGD515EI

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

229

2SP0115T2B0-12

2SP0115T2B0-12

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

119

2SD300C17A3

2SD300C17A3

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

72

2SP0115T2A0-17

2SP0115T2A0-17

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

137

1SC0450V2A0-65

1SC0450V2A0-65

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

286

2SD315AI UL

2SD315AI UL

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

200

1SD1548AI UL

1SD1548AI UL

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

0

2SC0108T2H0-17

2SC0108T2H0-17

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

315

2SP0115T2A0-12

2SP0115T2A0-12

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

379

2SP0320V2A0-17

2SP0320V2A0-17

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

30

2SP0115T2C0-06

2SP0115T2C0-06

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

28

1SC0450V2B0-65

1SC0450V2B0-65

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

27

2SD300C17A1

2SD300C17A1

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

839

2SP0320T2A0-17

2SP0320T2A0-17

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

103

2SC0535T2A1-33

2SC0535T2A1-33

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

39

2SP0320V2A0-12

2SP0320V2A0-12

Power Integrations

IC GATE DRVR HALF-BRIDGE MODULE

39

1SC0450E2B0-45

1SC0450E2B0-45

Power Integrations

IC GATE DRVR HI/LOW SIDE MODULE

27

PMIC - Gate Drivers

1. Overview

Power Management Integrated Circuit (PMIC) Gate Drivers are specialized ICs designed to control the switching of power transistors (MOSFETs/IGBTs) in power conversion systems. They act as intermediaries between control circuits (e.g., MCUs) and high-power devices, ensuring efficient signal amplification and isolation. Their importance lies in optimizing energy efficiency, reducing switching losses, and enabling precise control in applications ranging from consumer electronics to industrial automation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
MOSFET DriversHigh-speed switching, low output impedanceDC-DC converters, motor drives
IGBT DriversHigh-current output, desaturation protectionIndustrial inverters, EV chargers
High-Side/Low-Side DriversBootstrap circuit support, level-shiftingH-bridge motor controllers
Isolated Gate DriversGalvanic isolation (opto/magnetic)Solar inverters, medical power supplies

3. Structure and Composition

A typical PMIC Gate Driver IC comprises:

  • Input logic interface (CMOS/TTL compatible)
  • Pre-driver stage for signal amplification
  • High-current output stage (push-pull configuration)
  • Protection circuits (UVLO, OCP, OTP)
  • Dead-time control logic
  • Power supply management module
Packaged in QFN, TSSOP, or SOIC formats with thermal pads for heat dissipation.

4. Key Technical Specifications

ParameterImportance
Drive Current ( A)Determines switching speed and RDS(on) control
Propagation Delay (ns)Impacts switching efficiency in high-frequency designs
Supply Voltage Range (V)Defines compatibility with power transistor requirements
Isolation Rating (kV)Critical for safety in high-voltage applications
Operating Temperature (-40 C to +150 C)Ensures reliability in harsh environments

5. Application Fields

  • Consumer Electronics: Smartphones (DC-DC converters), Laptops (VRM drivers)
  • Industrial: PLC motor controllers, 48V telecom rectifiers
  • Automotive: On-Board Chargers (OBC), Battery Management Systems (BMS)
  • Renewable Energy: Solar micro-inverters, Wind turbine converters
  • Home Appliances: Induction cookers, Smart energy meters

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
TIUCC275xx Family120V bootstrap, 4A peak current
Infineon1EDN7512Short-circuit protection, 150ns delay
STMicroL6386EHigh-side/low-side, 600V rating
ON SemiNCV845xAEC-Q100 qualified for automotive
JWIPCJW5258Integrated bootstrap diode, 100V

7. Selection Guidelines

Key considerations:

  • Match drive current to transistor gate charge requirements
  • Verify voltage tolerance for high-side configurations
  • Assess protection features for system reliability
  • Evaluate package thermal performance (e.g., JA < 50 C/W)
  • Select isolation level per safety standards (e.g., DIN V VDE V 0884-11)
Example: For a 650V IGBT in a welding inverter, choose an isolated driver with >10A current and DESAT protection.

8. Industry Trends

Future developments include:

  • Integration with GaN/SiC device drivers for >1000V applications
  • Advanced sensing (current/voltage feedback) in package
  • PMBus interface for smart power systems
  • Automotive-grade reliability (AEC-Q100 Grade 0 support)
  • Sub-50ns propagation delay for 1MHz+ switching
Market growth driven by EVs and renewable energy systems requiring >1500W power stages with >97% efficiency.

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